Vibration Durability of Sn3.0Ag0.5Cu (SAC305) Solder Interconnects: Harmonic and Random Excitation

In this study, the durability of lead (Pb)-free tin(Sn3.0)silver(Ag0.5)copper(Cu) (SAC305) printed wiring assemblies (PWAs) is investigated under constant amplitude, narrow-band (harmonic) excitation and under step-stress broad-band (random) excitation, and compared to the durability of Pb-based Sn37Pb PWAs. The results show that Sn37Pb assemblies last longer than SAC305 assemblies at similar excitation levels, for both harmonic and random excitations used in this study. The test specimens are identical for all tests, consisting of a PWA with plastic ball grid array components, quad flat pack components, leadless ceramic chip carriers, and leadless chip resistors. The test matrix includes test boards with different kinds of finishes and different aging conditions. Both the harmonic and random vibration tests are conducted on single-axis electrodynamic shakers. The harmonic vibration excitation is applied to a single specimen at a time, while the random vibration excitation is applied simultaneously to 20 ...

[1]  C. Basaran,et al.  Mechanics of Pb40/Sn60 near-eutectic solder alloys subjected to vibrations , 1998 .

[2]  K. Upadhyayula,et al.  An incremental damage superposition approach for surface mount electronic interconnect durability under combined temperature and vibration environments , 1999 .

[3]  Abhijit Dasgupta,et al.  Vibration Durability Comparison of Sn37Pb vs SnAgCu Solders , 2006 .

[4]  Luhua Xu,et al.  Intermetallic growth studies on SAC/ENIG and SAC/Cu-OSP lead-free solder joints , 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

[5]  J. H. Lau,et al.  Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards , 1996 .

[6]  H.L.J. Pang,et al.  Vibration fatigue test and analysis for flip chip solder joints , 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

[7]  J. H. Lau,et al.  Solder joint reliability of flip chip and plastic ball grid array assemblies under thermal, mechanical, and vibration conditions , 1995, Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium.

[8]  A. Dasgupta,et al.  Stress Analysis of Surface-Mount Interconnections Due to Vibrational Loading , 1997 .

[9]  Fook Fah Yap,et al.  Reliability of PBGA assemblies under out-of-plane vibration excitations , 2002 .

[10]  J. Lau,et al.  Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting,and Vibration Conditions , 1996 .

[11]  E. Davitt,et al.  Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints , 2001, Microelectron. Reliab..

[12]  J. Lau,et al.  Solder Joint Reliability of Surface Mount Connectors , 1993 .

[13]  Abhijit Dasgupta,et al.  Estimating the Vibration Fatigue Life of Quad Leaded Surface Mount Components , 1993 .

[14]  Qiang Guo,et al.  Vibration fatigue experiments of SMT solder joint , 2004, Microelectron. Reliab..