Hybrid Systems-in-Foil - Combining Thin Chips with Large-Area Electronics

This paper reports on the status of a comprehensive ten-year research and development effort towards Hybrid System-in-Foil (HySiF). In HySiF, the merits of high-performance integrated circuits on ultra-thin chips and of large-area and discrete electronic component implementation are combined in a complementary fashion attached on or laminated in a flexible carrier substrate. HySiF paves the way to entirely new applications of electronic products where form factor, form adaptivity or form flexibility are key enablers. In this review paper the various aspects of thin-chip fabrication and embedding, device and circuit design under impact of unknown or variable mechanical stress, and the on- and off-chip implementation of sensor, actuator, microwave and energy supply components are discussed.

[1]  H. Reichl,et al.  Embedding of Chips for System in Package realization - Technology and Applications , 2008, 2008 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference.

[2]  K MadisettiVijay,et al.  System on Chip or System on Package , 1999 .

[3]  Joachim N. Burghartz,et al.  A new CMOS stress sensor ratiometric readout for in-plane stress magnitude and angle detection , 2017, 2017 IEEE SENSORS.

[4]  Joachim N. Burghartz,et al.  Measurement-Based Compact Thermal Model Extraction Methodology for Packaged ICs , 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[5]  Vijay K. Madisetti,et al.  System on Chip or System on Package? , 1999, IEEE Des. Test Comput..

[6]  Joachim N. Burghartz,et al.  Ultra-thin relative humidity sensors for hybrid system-in-foil applications , 2017, 2017 IEEE SENSORS.

[7]  Tarek Zaki.  Short-Channel Organic Thin-Film Transistors: Fabrication, Characterization, Modeling and Circuit Demonstration , 2015 .

[8]  E. Helerea,et al.  Improving the behaviour of portable power supply for pulsated loads , 2012, 2012 International Conference on Applied and Theoretical Electricity (ICATE).

[9]  J. N. Burghartz,et al.  Two-Dimensional Flex Sensor Exploiting Stacked Ultrathin Chips , 2012, IEEE Electron Device Letters.

[10]  K. A. Jenkins,et al.  Impact of self-heating on digital SOI and strained-silicon CMOS circuits , 2003, 2003 IEEE International Conference on SOI.

[11]  Joachim N. Burghartz,et al.  Ultra-thin chip technology for system-in-foil applications , 2010, 2010 International Electron Devices Meeting.

[12]  Tsuyoshi Murata,et al.  {m , 1934, ACML.

[13]  Joachim N. Burghartz,et al.  Ultra-thin smart electronic skin based on hybrid system-in-foil concept combining three flexible electronics technologies , 2018 .

[14]  Joachim N. Burghartz,et al.  Anomalous stress effects in ultra-thin silicon chips on foil , 2009, 2009 IEEE International Electron Devices Meeting (IEDM).

[15]  Yin-Po Hung,et al.  Process and characterization of ultra-thin film packages , 2010, 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference.

[16]  M. Stevenson,et al.  Active-Matrix Amorphous-Silicon TFTs Arrays at 180$^circhboxC$on Clear Plastic and Glass Substrates for Organic Light-Emitting Displays , 2006, IEEE Transactions on Electron Devices.

[17]  Martin Zimmermann,et al.  Ultra-Thin Chips on Foil for Flexible Electronics , 2008, 2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers.

[18]  J.R. Long,et al.  An Assessment of µ-Czochralski, Single-Grain Silicon Thin-Film Transistor Technology for Large-Area, Sensor and 3-D Electronic Integration , 2008, IEEE Journal of Solid-State Circuits.

[19]  Joachim N. Burghartz,et al.  Optimized adaptive layout technique for hybrid systems in foil , 2017, 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition.

[20]  Joachim N. Burghartz,et al.  Hybrid Systems in foil (HySiF) exploiting ultra-thin flexible chips , 2014, 2014 44th European Solid State Device Research Conference (ESSDERC).

[21]  R. Hagen,et al.  Embedded Wafer Level Ball Grid Array (eWLB) , 2008, 2008 10th Electronics Packaging Technology Conference.

[22]  Tadatomo Suga,et al.  Direct bonding and debonding of glass wafers for handling of ultra-thin glass sheets , 2016, 2016 International Conference on Electronics Packaging (ICEP).

[23]  W. Appel,et al.  A New Fabrication and Assembly Process for Ultrathin Chips , 2009, IEEE Transactions on Electron Devices.

[24]  Jin Jang.  Past, current and future TFT technologies for display manufacturing , 2013, 2013 Twentieth International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD).

[25]  F. Morin.  Amorphous Silicon TFTs and their Applications , 1992, ESSDERC '92: 22nd European Solid State Device Research conference.

[26]  H. Rempp,et al.  Mechanical characterisation of ultra-thin chips , 2011, 2011 Semiconductor Conference Dresden.

[27]  Joachim N. Burghartz,et al.  Compensation of externally applied mechanical stress by stacking of ultra-thin chips , 2011, 2011 Proceedings of the European Solid-State Device Research Conference (ESSDERC).

[28]  Joachim N. Burghartz,et al.  Assembly and embedding of ultra-thin chips in polymers , 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).

[29]  E Bosman,et al.  UTCP: A Novel Polyimide-Based Ultra-Thin Chip Packaging Technology , 2010, IEEE Transactions on Components and Packaging Technologies.

[30]  Karlheinz Bock,et al.  Polymer Electronics Systems - Polytronics , 2005, Proceedings of the IEEE.

[31]  J. Burghartz,et al.  Ultra-thin chips and related applications, a new paradigm in silicon technology , 2009, ESSDERC 2009.

[32]  Yonggang Huang,et al.  Stretchable and Foldable Silicon Integrated Circuits , 2008, Science.

[33]  Tarek Zaki,et al.  Short-Channel Organic Thin-Film Transistors: Fabrication, Characterization, Modeling and Circuit Demonstration , 2015 .

[34]  M. Gaynes,et al.  Advanced flexible CMOS integrated circuits on plastic enabled by controlled spalling technology , 2012, 2012 International Electron Devices Meeting.

[35]  J. Kostelnik,et al.  Ultra-thin Silicon Chips in Flexible Microsystems , 2014 .

[36]  J. F. Ribeiro,et al.  Flexible thin-film rechargeable lithium battery , 2013, 2013 Transducers & Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS & EUROSENSORS XXVII).

[37]  Naveen Verma,et al.  Integrating and Interfacing Flexible Electronics in Hybrid Large-Area Systems , 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[38]  J. Burghartz.  Ultra-thin Chip Technology and Applications , 2010 .

[39]  J. R. Ganasan.  Chip on chip (COC) and chip on board (COB) assembly on flex rigid printed circuit assemblies , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

[40]  Robert S. Howell,et al.  Polysilicon TFT technology for active matrix OLED displays , 2001 .

[41]  Joachim N. Burghartz,et al.  An Ultra-Thin Flexible CMOS Stress Sensor Demonstrated on an Adaptive Robotic Gripper , 2016, IEEE Journal of Solid-State Circuits.

[42]  Guangming Wang,et al.  High performance metal oxide TFT and its applications for thin film electronics , 2014, 2014 IEEE International Electron Devices Meeting.

[43]  Keon Jae Lee,et al.  Bendable inorganic thin-film battery for fully flexible electronic systems. , 2012, Nano letters.

[44]  Yonggang Huang,et al.  Transfer printing by kinetic control of adhesion to an elastomeric stamp , 2006 .