Review of Heat Transfer Technologies in Electronic Equipment

[1]  R. Pease,et al.  High-performance heat sinking for VLSI , 1981, IEEE Electron Device Letters.

[2]  K. H. Token,et al.  A novel concept for reducing thermal contact resistance , 1982 .

[3]  W. Little,et al.  Measurement of friction factors for the flow of gases in very fine channels used for microminiature Joule-Thomson refrigerators , 1983 .

[4]  Allan D. Kraus,et al.  Thermal Analysis and Control of Electronic Equipment , 1983 .

[5]  Ephraim M Sparrow,et al.  Convective heat transfer response to height differences in an array of block-like electronic components , 1984 .

[6]  W. Little,et al.  Measurement of the heat transfer characteristics of gas flow in fine channel heat exchangers used for microminiature refrigerators , 1984 .

[7]  M. Yovanovich,et al.  Enhancement of Thermal Contact Conductance by Metallic Coatings: Theory and Experiment , 1985 .

[8]  V. Antonetti,et al.  Bibliography of Heat Transfer in Electronic Equipment , 1985 .

[9]  E. Sparrow,et al.  Orientation effects on natural convection/radiation heat transfer from pin-fin arrays , 1986 .

[10]  L. T. Yeh,et al.  NUMERICAL SOLUTIONS FOR A MULTIPLE-CHANNEL COUNTERFLOW HEAT EXCHANGER WITH SPACE-DEPENDENT WALL HEAT DISSIPATIONS , 1986 .

[11]  Wilson F. N. Santos,et al.  Heat-transfer and pressure drop experiments in air-cooled electronic-component arrays , 1986 .

[12]  Majid Keyhani,et al.  An experimental study of natural convection in a vertical cavity with discrete heat sources , 1988 .

[13]  A. E. Bergles,et al.  A method to reduce temperature overshoots in immersion cooling of microelectronic devices , 1988, InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88.

[14]  R. Beach,et al.  Demonstration of high‐performance silicon microchannel heat exchangers for laser diode array cooling , 1988 .

[15]  A. Bergles,et al.  Effects of Size of Simulated Microelectronic Chips on Boiling and Critical Heat Flux , 1988 .

[16]  Peng-cheng Lin.  An experimental study of natural convection from protruding arrays on a vertical plate with and without an opposing wall for various fluids , 1988 .

[17]  Yutaka Asako,et al.  Three-Dimensional Heat Transfer and Fluid Flow Analysis of Arrays of Square Blocks Encountered in Electronic Equipment , 1988 .

[18]  Avram Bar-Cohen,et al.  Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1 , 1988 .

[19]  Leroy S. Fletcher,et al.  Thermal contact conductance in the presence of thin metal foils , 1988 .

[20]  R. Phillips,et al.  Microchannel heat sinks , 1988 .

[21]  Anthony M. Jacobi,et al.  Flow and heat transfer in microchannels using a microcontinuum approach , 1989 .

[22]  D. A. Kaminski,et al.  Natural Convection and Radiation Heat Transfer From an Array of Inclined Pin Fins , 1989 .

[23]  I. Mudawar,et al.  High Flux Electronic Cooling by Means of Pool Boiling-Part I : Parametric Investigation of the Effects of Coolant Variation, Pressurization, Subcooling, and Surface Augmentation , 1989 .

[24]  Terrence W. Simon,et al.  Heat Transfer From a Small Heated Region to R-113 and FC-72 , 1989 .

[25]  Richard A. Wirtz,et al.  Experimental Modeling of Convection Downstream from an Electronic Package Row , 1989 .

[26]  A.H. Iversen,et al.  Uniform temperature, ultrahigh flux heat sinks using curved surface subcooled nucleate boiling , 1989, Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

[27]  L. S. Fletcher,et al.  A review of thermal enhancement techniques for electronic systems , 1990 .

[28]  Kemal Tuzla,et al.  COOLING OF ELECTRONIC CHIPS IN LIQUID NITROGEN , 1990 .

[29]  D. C. Wadsworth,et al.  Cooling of a multichip electronic module by means of confined two-dimensional jets of dielectric liquid , 1990 .

[30]  B. R. Babin,et al.  Steady-State Modeling and Testing of a Micro Heat Pipe , 1990 .

[31]  Dennis J. Herrell,et al.  High performance air cooled heat sinks for integrated circuits , 1990 .

[32]  G. P. Peterson,et al.  Thermal Control of Electronic Equipment and Devices , 1990 .

[33]  G. Peterson,et al.  Transient experimental investigation of micro heat pipes , 1991 .

[34]  Majid Keyhani,et al.  The Aspect Ratio Effect on Natural Convection in an Enclosure With Protruding Heat Sources , 1991 .

[35]  G. Peterson,et al.  Investigation of the transient characteristics of a micro heat pipe , 1991 .

[36]  Ann M. Anderson,et al.  Direct Air Cooling of Electronic Components: Reducing Component Temperatures by Controlled Thermal Mixing , 1991 .

[37]  Sushil H. Bhavnani,et al.  Re-entrant cavity surface enhancements for immersion cooling of silicon multichip packages , 1992, [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems.

[38]  R. C. Estes.  The effect of thermal capacitance and phase change on outside plant electronic enclosures , 1992 .

[39]  M. Mahalingam,et al.  Thermal management control without overshoot using combinations of boiling liquids , 1992, [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems.

[40]  J. Zemel,et al.  Analysis of microchannels for integrated cooling , 1992 .

[41]  S. M. You,et al.  A technique for enhancing boiling heat transfer with application to cooling of electronic equipment , 1992 .

[42]  R. K. Shah,et al.  Aerospace heat exchanger technology, 1993 : proceedings of the First International Conference on Aerospace Heat Exchanger Technology, Palo Alto, CA, USA, 15-17 February, 1993 , 1993 .

[43]  X. Peng,et al.  Forced convection and flow boiling heat transfer for liquid flowing through microchannels , 1993 .

[44]  K. Miura,et al.  Numerical Study of Flow and Heat Transfer for Circular Jet Impingement on the Bottom of a Cylindrical Cavity , 1993 .

[45]  M. Aziz,et al.  Convective Heat Transfer Enhancement Due to Intermittency in an Impinging Jet , 1993 .

[46]  L. T. Yeh,et al.  Thermally developing convection from Newtonian flow in rectangular ducts with uniform heating , 1993 .

[47]  A. B. Duncan,et al.  Experimental Investigation of Micro Heat Pipes Fabricated in Silicon Wafers , 1993 .

[48]  Yogendra Joshi,et al.  Natural Convection Heat Transfer From an Array of Rectangular Protrusions in an Enclosure Filled With Dielectric Liquid , 1994 .

[49]  C. L. Chapman,et al.  Thermal performance of an elliptical pin fin heat sink , 1994, Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[50]  I. Mudawar,et al.  Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints , 1994 .

[51]  X. Peng,et al.  Experimental investigation on liquid forced-convection heat transfer through microchannels☆ , 1994 .

[52]  Issam Mudawar,et al.  High flux boiling in low flow rate, low pressure drop mini-channel and micro-channel heat sinks , 1994 .

[53]  Bu-Xuan Wang,et al.  LIQUID FLOW AND HEAT TRANSFER IN MICROCHANNELS WITH/WITHOUT PHASE CHANGE , 1994 .

[54]  Kee-Chiang Chung,et al.  Enhancement of thermal contact conductance of coated junctions , 1995 .

[55]  G. Peterson,et al.  Experimental investigation of heat transfer in flat plates with rectangular microchannels , 1995 .

[56]  L. Chow,et al.  Nucleate Boiling Heat Transfer in Spray Cooling , 1996 .