Integrating stereolithography and direct print technologies for 3D structural electronics fabrication

Purpose – The purpose of this paper is to present a hybrid manufacturing system that integrates stereolithography (SL) and direct print (DP) technologies to fabricate three‐dimensional (3D) structures with embedded electronic circuits. A detailed process was developed that enables fabrication of monolithic 3D packages with electronics without removal from the hybrid SL/DP machine during the process. Successful devices are demonstrated consisting of simple 555 timer circuits designed and fabricated in 2D (single layer of routing) and 3D (multiple layers of routing and component placement).Design/methodology/approach – A hybrid SL/DP system was designed and developed using a 3D Systems SL 250/50 machine and an nScrypt micro‐dispensing pump integrated within the SL machine through orthogonally‐aligned linear translation stages. A corresponding manufacturing process was also developed using this system to fabricate 2D and 3D monolithic structures with embedded electronic circuits. The process involved part de...

[1]  S. Sampath,et al.  Sensors for harsh environments by direct-write thermal spray , 2004, IEEE Sensors Journal.

[2]  R. Mosses,et al.  A novel process for the manufacturing of advanced interconnects , 2003 .

[3]  Jang Sub Kim,et al.  Direct writing of copper conductive patterns by ink-jet printing , 2007 .

[4]  Kenneth Ward Church,et al.  Commercial Applications and Review for Direct Write Technologies , 2000 .

[5]  N. Halonen,et al.  Gravure printing of conductive particulate polymer inks on flexible substrates , 2005 .

[6]  Ryan B. Wicker,et al.  Electronics integration in conformal substrates fabricated with additive layered manufacturing , 2009 .

[7]  C. Grigoropoulos,et al.  Microstructuring by printing and laser curing of nanoparticle solutions , 2003 .

[8]  Hod Lipson,et al.  Freeform fabrication of ionomeric polymer‐metal composite actuators , 2006, Rapid Prototyping Journal.

[9]  Ryan B. Wicker,et al.  Integration of Direct-Write (DW) and Ultrasonic Consolidation (UC) Technologies to Create Advanced Structures with Embedded Electrical Circuitry. , 2006 .

[10]  R. Wicker,et al.  Development of an automated multiple material stereolithography machine , 2006 .

[11]  Brent Stucker,et al.  Use of ultrasonic consolidation for fabrication of multi‐material structures , 2007 .

[12]  Zbigniew J. Czajkiewicz.  DIRECT DIGITAL MANUFACTURING - NEW PRODUCT DEVELOPMENT AND PRODUCTION TECHNOLOGY (Bezposrednie Cyfrowe Wytwarzanie (DDM) - rozwój nowego produktu i technologii produkcyjnej) , 2008 .

[13]  Ryan B. Wicker,et al.  Realizing 3-D interconnected direct write electronics within smart stereolithography structures , 2005 .

[14]  Thierry Chartier,et al.  Stereolithography for manufacturing ceramic parts , 2000 .

[15]  Ryan B. Wicker,et al.  Integrating multiple rapid manufacturing technologies for developing advanced customized functional devices , 2005 .

[16]  Ming-Chuan Leu,et al.  Progress in Additive Manufacturing and Rapid Prototyping , 1998 .

[17]  张哉根,et al.  Leu-M , 1991 .

[18]  J. C. Jagt.  Reliability of electrically conductive adhesive joints for surface mount applications: a summary of the state of the art , 1998 .

[19]  Eric MacDonald,et al.  Integrated layered Manufacturing of a Novel Wireless Motion Sensor System with GPS. , 2007 .

[20]  Lixin Mo,et al.  Preparation and Conductive Mechanism of the Ink-Jet Printed Nanosilver Films for Flexible Display , 2009, 2009 2nd International Congress on Image and Signal Processing.

[21]  Ryan B. Wicker.  Rapid Prototyping of High Density Circuitry , 2013 .

[22]  Hod Lipson,et al.  Freeform fabrication and characterization of Zn‐air batteries , 2008 .

[23]  Constantinos Mavroidis,et al.  Rapid robot reproduction , 2004, IEEE Robotics & Automation Magazine.

[24]  Bhanu Pratap,et al.  Embedding electronic circuits by laser direct-write , 2006 .

[25]  N. D. Burns,et al.  Rapid manufacturing: impact on supply chain methodologies and practice , 2007 .

[26]  Constantinos Mavroidis,et al.  Fabrication of Nonassembly Robotic Systems with Embedded Components Using a Rapid Prototyping System , 2004 .

[27]  Fritz B. Prinz,et al.  Shape deposition manufacturing of heterogeneous structures , 1997 .

[28]  Alberto Piqué,et al.  Laser Direct-Write Techniques for Printing of Complex Materials , 2007 .

[29]  Jooho Moon,et al.  Highly Conductive Ink Jet Printed Films of Nanosilver Particles for Printable Electronics , 2005 .

[30]  Hod Lipson,et al.  Printing Embedded Circuits , 2007 .

[31]  David W. Rosen,et al.  Building around inserts: methods for fabricating complex devices in stereolithography , 2001 .

[32]  Pekka Ruuskanen,et al.  The characterization of electrically conductive silver ink patterns on flexible substrates , 2009, Microelectron. Reliab..

[33]  Paul F. Jacobs,et al.  Rapid Prototyping & Manufacturing: Fundamentals of Stereolithography , 1992 .

[34]  Eric MacDonald,et al.  Expanding rapid prototyping for electronic systems integration of arbitrary form , 2006 .

[35]  R. Street,et al.  Thermal cure effects on electrical performance of nanoparticle silver inks , 2007 .