Modelling of metal degradation in power devices under active cycling conditions
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W. Kanert | R. Pufall | R. Dudek | O. Wittler | R. Dudek | O. Wittler | M. Bouazza | M. Bouazza | R. Pufall | W. Kanert
[1] Mauro Ciappa,et al. Plastic-strain of aluminium interconnections during pulsed operation of IGBT multichip modules , 1996 .
[2] A NEW METHOD TO STUDY CYCLIC DEFORMATION OF THIN FILMS IN TENSION AND COMPRESSION , 1999 .
[3] Martin Pfost,et al. Measurement and Simulation of Self-Heating in DMOS Transistors up to Very High Temperatures , 2008, 2008 20th International Symposium on Power Semiconductor Devices and IC's.
[4] Philippe Dupuy,et al. Characterization of alterations on power MOSFET devices under extreme electro-thermal fatigue , 2010, Microelectron. Reliab..
[5] Werner Kanert,et al. Reliability challenges for power devices under active cycling , 2009, 2009 IEEE International Reliability Physics Symposium.
[6] Keith C. Norris,et al. Reliability of controlled collapse interconnections , 1969 .