Polystyrene-Core Silica-Shell Composite Abrasives: The Influence of Core Size on Oxide Chemical Mechanical Planarization

[1]  Naiming Miao,et al.  Synergetic effect of organic cores and inorganic shells for core/shell structured composite abrasives for chemical mechanical planarization , 2014 .

[2]  Ailian Chen,et al.  Compressive elastic moduli and polishing performance of non-rigid core/shell structured PS/SiO2 composite abrasives evaluated by AFM , 2014 .

[3]  Michael D. Feit,et al.  Microscopic Removal Function and the Relationship Between Slurry Particle Size Distribution and Workpiece Roughness During Pad Polishing , 2014 .

[4]  Taesung Kim,et al.  The Synthesis of Novel Polystyrene-SiO2 Composite Abrasive for CMP Slurry , 2013 .

[5]  H. Lei,et al.  Preparation of porous alumina/ceria composite abrasive and its chemical mechanical polishing behavior , 2013 .

[6]  D. Zhao,et al.  Extension of the Stöber Method to Construct Mesoporous SiO2 and TiO2 Shells for Uniform Multifunctional Core–Shell Structures , 2013, Advanced materials.

[7]  H. Lei,et al.  Preparation of porous Fe2O3/SiO2 nanocomposite abrasives and their chemical mechanical polishing behaviors on hard disk substrates , 2012 .

[8]  H. Lei,et al.  Preparation of copper-incorporated mesoporous alumina abrasive and its CMP behavior on hard disk substrate , 2012 .

[9]  H. Lei,et al.  Preparation of porous alumina abrasives and their chemical mechanical polishing behavior , 2012 .

[10]  Liangchi Zhang,et al.  A statistical model for material removal prediction in polishing , 2012 .

[11]  Yang Chen,et al.  Polishing behavior of PS/CeO2 hybrid microspheres with controlled shell thickness on silicon dioxide CMP , 2011 .

[12]  Zhigang Chen,et al.  Preparation, characterization and oxide CMP performance of composite polystyrene-core ceria-shell abrasives , 2011 .

[13]  R. Singh,et al.  Polishing behaviors of ceria abrasives on silicon dioxide and silicon nitride CMP , 2011 .

[14]  Jun Wang,et al.  Modeling effects of abrasive particle size and concentration on material removal at molecular scale in chemical mechanical polishing , 2010 .

[15]  Xinchun Lu,et al.  Monoatomic layer removal mechanism in chemical mechanical polishing process: A molecular dynamics study , 2010 .

[16]  Mahadevaiyer Krishnan,et al.  Chemical mechanical planarization: slurry chemistry, materials, and mechanisms. , 2010, Chemical reviews.

[17]  Shiyou Hao,et al.  Surface charge tuning of ceria particles by titanium doping: Towards significantly improved polishing performance , 2009 .

[18]  Jongwon Seok,et al.  An integrated material removal model for silicon dioxide layers in chemical mechanical polishing processes , 2009 .

[19]  K. Maex,et al.  Engineering polymer core-silica shell size in the composite abrasives for CMP applications , 2008 .

[20]  Yongguang Wang,et al.  Modeling effect of chemical–mechanical synergy on material removal at molecular scale in chemical mechanical polishing , 2008 .

[21]  Yongguang Wang,et al.  Research on the molecular scale material removal mechanism in chemical mechanical polishing , 2008 .

[22]  K. Maex,et al.  Composite Polymer-Core Silica-Shell Abrasive Particles during Oxide CMP A Defectivity Study , 2007 .

[23]  K. Maex,et al.  Nanoscale indentation of polymer and composite polymer-silica core-shell submicrometer particles by atomic force microscopy. , 2007, Langmuir : the ACS journal of surfaces and colloids.

[24]  Zhong Lin Wang,et al.  Converting Ceria Polyhedral Nanoparticles into Single-Crystal Nanospheres , 2006, Science.

[25]  Ping Hsun Chen,et al.  A chemical kinetics model to explain the abrasive size effect on chemical mechanical polishing , 2005 .

[26]  Christina Graf,et al.  A General Method To Coat Colloidal Particles with Silica , 2003 .

[27]  S. Babu,et al.  The use of monodispersed colloids in the polishing of copper and tantalum. , 2003, Journal of Colloid and Interface Science.

[28]  W. Stöber,et al.  Controlled growth of monodisperse silica spheres in the micron size range , 1968 .