12인치 Wafer Final Polishing 장비 개발

In this paper, we reported a final polishing machine for 300 ㎜ bare wafer. The final polishing system of bare 300 ㎜ wafer is developed for replacing multistage polishing and grinding process with high quality of flatness required in 0.13 ㎛ design rule. The machine had three polishing tables and eight rotating heads that carries wafers attached on a indexing column so that three steps of the process were possible. The machine structure and components were designed and developed with support of numerical analysis for static and dynamic characteristics. The prototype built with utilities were tested, and the results of surface quality and flatness were discussed.