Interstitial Redundancy: An Area Efficient Fault Tolerance Scheme for Large Area VLSI Processor Arrays

In the proposed scheme, spare PEs are located at interstitial sites within the array. Each spare can functionally replace any one of the neighboring primary PEs that are connected to it. Because spares are physically close to the PE that they replace, restructured interconnections are short, minimizing performance degradation. This structure can incorporate different levels of redundancy depending on how many of the interstitial sites are used to locate spares, and also how many spares are placed at each site. The author gives a polynomial time algorithm for assigning operational spares to failed primary PEs. He also gives area efficient layouts for such structures, and designs for implementing the switching network needed for reconfiguration. A procedure for deciding the optimum level of redundancy so as to maximize chip area utilization is also shown. The main attractive features of interstitial redundancy are short (fixed length) PE interconnections and high utilization of failure-free PEs. The analysis shows that for a wide range of array sizes and PE survival probabilities, 45-55 percent utilization of failure-free PEs on the chip can be achieved. >

[1]  Israel Koren A reconfigurable and fault-tolerant VLSI multiprocessor array , 1981, ISCA '81.

[2]  Vinod K. Agarwal,et al.  A Fault-Tolerant Modular Architecture for Binary Trees , 1986, IEEE Transactions on Computers.

[3]  Arnold L. Rosenberg A Hypergraph Model for Fault-Tolerant VLSI Processor Arrays , 1985, IEEE Transactions on Computers.

[4]  Frank Thomson Leighton,et al.  Wafer-Scale Integration of Systolic Arrays , 1985, IEEE Trans. Computers.

[5]  Melvin A. Breuer,et al.  On Area and Yield Considerations for Fault-Tolerant VLSI Processor Arrays , 1984, IEEE Transactions on Computers.

[6]  Arnold L. Rosenberg,et al.  The Diogenes Approach to Testable Fault-Tolerant Arrays of Processors , 1983, IEEE Transactions on Computers.

[7]  R.C. Aubusson,et al.  Wafer-scale integration-a fault-tolerant procedure , 1978, IEEE Journal of Solid-State Circuits.

[8]  M. Wada,et al.  A redundancy circuit for a fault-tolerant 256K MOS RAM , 1982, IEEE Journal of Solid-State Circuits.

[9]  H. T. Kung Why systolic architectures? , 1982, Computer.

[10]  Kye Sherrick Hedlund Wafer scale integration of configurable, highly parallel processors , 1982 .

[11]  D. C. Shaver Electron-beam customization repair, and testing of wafer-scale circuits , 1984 .

[12]  Abbas El Gamal,et al.  Configuration of VLSI Arrays in the Presence of Defects , 1984, JACM.

[13]  Donald S. Fussell,et al.  Fault-tolerant wafer-scale architectures for VLSI , 1982, ISCA 1982.

[14]  Algirdas Avizienis,et al.  Fault-Tolerant Design for VLSI: Effect of Interconnect Requirements on Yield Improvement of VLSI Designs , 1982, IEEE Transactions on Computers.

[15]  R. G. Nelson,et al.  Laser programmable redundancy and yield improvement in a 64K DRAM , 1981 .