3D technology roadmap and status
暂无分享,去创建一个
Bart Vandevelde | Eric Beyne | Paul Marchal | Dimitri Linten | Vladimir Cherman | Steven Thijs | Mustafa Badaroglu | Abdelkarim Mercha | Michele Stucchi | Victor Moroz | Geert Eneman | Geert Van der Plas | Kristof Croes | Augusto Redolfi | Youssef Travaly | Katti Guruprasad | Herman O'Prins | Antonio La Manna | Rudi Cartuyvels
[1] Bernard Flechet,et al. Integration and Frequency Dependent Parametric Modeling of Through Silicon via Involved in High Density 3D Chip Stacking , 2010 .
[2] John H. Lau,et al. Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package , 2009, 2009 59th Electronic Components and Technology Conference.
[3] C. Chen,et al. Through-silicon via technologies for interconnects in RF MEMS , 2009, 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS.
[4] D. Henry,et al. Development and characterisation of a 3D technology including TSV and Cu pillars for high frequency applications , 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).
[5] Y. Lamy,et al. RF Characterization and Analytical Modelling of Through Silicon Vias and Coplanar Waveguides for 3D Integration , 2010, IEEE Transactions on Advanced Packaging.