VLSI considerations for TESH: a new hierarchical interconnection network for 3-D integration
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[1] S. Horiguchi,et al. A hierarchical redundant cube-connected cycle for WSI yield enhancement , 1995, Proceedings IEEE International Conference on Wafer Scale Integration (ICWSI).
[2] V. K. Jain,et al. Reconfiguration and yield for TESH: a new hierarchical interconnection network for 3-D integration , 1996, 1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon.
[3] William J. Dally,et al. Performance Analysis of k-Ary n-Cube Interconnection Networks , 1987, IEEE Trans. Computers.
[4] A. Boubekeur,et al. Interconnection networks with fault-tolerance properties , 1993, 1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration.
[5] Kai Hwang,et al. Computer architecture and parallel processing , 1984, McGraw-Hill Series in computer organization and architecture.
[6] Vijay K. Jain,et al. Rapid prototyping of parallel processing systems on TESH network , 1998, Proceedings. Ninth International Workshop on Rapid System Prototyping (Cat. No.98TB100237).
[7] M. L. Campbell,et al. 3D wafer stack neurocomputing , 1993, 1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration.
[8] Howard Jay Siegel,et al. Interconnection networks for large-scale parallel processing: theory and case studies (2nd ed.) , 1985 .
[9] Franco P. Preparata,et al. The cube-connected-cycles: A versatile network for parallel computation , 1979, 20th Annual Symposium on Foundations of Computer Science (sfcs 1979).
[10] J. Carson. The emergence of stacked 3D silicon and its impact on microelectronics systems integration , 1996, 1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon.
[11] Arnold L. Rosenberg,et al. Three-Dimensional VLSI: a case study , 1983, JACM.
[12] J. G. Nash,et al. The 3-D Computer , 1989, [1989] Proceedings International Conference on Wafer Scale Integration.
[13] V. K. Jain,et al. Data manipulator network for WSI designs , 1990, 1990 Proceedings. International Conference on Wafer Scale Integration.
[14] Mitsumasa Koyanagi,et al. Three-dimensional integration technology for real time micro-vision system , 1997, 1997 Proceedings Second Annual IEEE International Conference on Innovative Systems in Silicon.