Single-wall carbon nanotube (SWCNT) functionalized Sn–Ag–Cu lead-free composite solders

Abstract Sn–3.8Ag–0.7Cu-based composite solders functionalized with single-wall carbon nanotubes (SWCNTs) with various weight proportions ranging from 0.01 to 1 wt% were successfully produced. The microstuctural, melting and mechanical properties of Sn–3.8Ag–0.7Cu-based composite solders were evaluated as a function of different wt% of SWCNT addition. The microstructures of the composite specimens were studied by means of field-emission scanning electron microscope (FE-SEM). It was observed that SWCNTs were homogeneously distributed at the edges of Ag 3 Sn compounds that are distributed evenly in the β-Sn solder matrix. Energy dispersion X-ray (EDX) analysis method was employed to reveal the presence of the phases existed in the solder composites. The mechanical properties of the composite solders were evaluated by Vickers-microhardness measurements and tensile tests performed at room temperature. The different wt% and addition of SWCNTs to Sn–3.8Ag–0.7Cu produced a dramatic increase in tensile strength, hardness, and better melting characteristics. A slight decrease in elongation to failure was observed. FE-SEM observations of the fracture surface, revealed the overall failure mechanism as the ductile manner of failure.

[1]  S. Frankland,et al.  Transverse mechanical properties of single-walled carbon nanotube crystals. Part I: determination of elastic moduli , 2003 .

[2]  S. Nai,et al.  DEVELOPMENT OF NOVEL LEAD-FREE SOLDER COMPOSITES USING CARBON NANOTUBE REINFORCEMENTS , 2005 .

[3]  J. Wei,et al.  Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites , 2006 .

[4]  A. Züttel,et al.  Synthesis of oriented nanotube films by chemical vapor deposition , 2002 .

[5]  J. Wei,et al.  Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes , 2006 .

[6]  Weidong Huang,et al.  The influences of processing parameters on forming characterizations during laser rapid forming , 2003 .

[7]  J. Ziman.  Principles of the Theory of Solids , 1965 .

[8]  King-Ning Tu,et al.  Current-crowding-induced electromigration failure in flip chip solder joints , 2002 .

[9]  P. Hou,et al.  Fabrication of nano-Al based composites reinforced by single-walled carbon nanotubes , 2003 .

[10]  Jing-kun Guo,et al.  Fabrication and mechanical properties of SiO2 matrix composites reinforced by carbon nanotube , 2003 .

[11]  D. Schiraldi,et al.  Processing, structure, and properties of fibers from polyester/carbon nanofiber composites , 2003 .

[12]  Angel Rubio,et al.  Mechanical properties of carbon nanotubes: a fiber digest for beginners , 2002 .

[13]  D. Lim,et al.  Tribological properties of hot-pressed alumina–CNT composites , 2003 .

[14]  Kwang-Lung Lin,et al.  The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys—the effect of Ag , 2002 .

[15]  Paul T. Vianco,et al.  Issues in the replacement of lead-bearing solders , 1993 .

[16]  J. Kenny,et al.  Morphological characterization of single-walled carbon nanotubes-PP composites , 2003 .

[17]  P. Couchman.  The Lindemann hypothesis and the size dependence of melting temperatures. II , 1978 .

[18]  B. Piekarski,et al.  A Mössbauer Study of Tin-Based Intermetallics Formed During the Manufacture of Dispersion-Strengthened Composite Solders , 1997 .

[19]  L. Wang,et al.  Improvement on the microstructure stability, mechanical and wetting properties of Sn-Ag-Cu lead-free solder with the addition of rare earth elements , 2004 .

[20]  Linda S. Schadler,et al.  LOAD TRANSFER IN CARBON NANOTUBE EPOXY COMPOSITES , 1998 .

[21]  J. Glazer.  Microstructure and mechanical properties of Pb-free solder alloys for low-cost electronic assembly: A review , 1994 .

[22]  David Hui,et al.  The revolutionary creation of new advanced materials - Carbon nanotube composites , 2002 .

[23]  J. L. Marshall,et al.  Composite solders , 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.

[24]  Sungho Jin,et al.  New, creep-resistant, low melting point solders with ultrafine oxide dispersions , 1998 .