论文信息 - Board design optimization for fine pitch BGA components

Board design optimization for fine pitch BGA components

With the dominance of surface mounted technology in electronics mass production, the application of fine pitch components became common due to their small size and increasing functionality. These components are considered fine pitch, if lead pitches are equal or lower than 0.65 mm (25 mils) [1]. For Ball Grid Array (BGA) components, this value by IPC standards is considered to be around 1 mm (39 mil) [2]. Fine pitch ICs require careful approach for design, assembly and process control.

Attila Geczy | Zsolt Illyefalvi-Vitez

[1] Stephen H. Hall,et al. High-Speed Digital System Design: A Handbook of Interconnect Theory and Design Practices , 2000 .

[2] Zsolt Illyefalvi-Vitez,et al. Optimizing technological process for laser soldering of fine-pitch flip chips , 2009, 2009 32nd International Spring Seminar on Electronics Technology.

[3] J. Chung,et al. Design of PCB Impedance Matching Inductors and Antennas for Single-Chip Communication Systems , 2008 .

[4] S. Stalf. Printed inductors in RF consumer applications , 2001, ICCE. International Conference on Consumer Electronics (IEEE Cat. No.01CH37182).