Three-dimensional surface inspection for semiconductor components with fringe projection profilometry

With the increasing integration level of components in modern electronic devices, three-dimensional automated optical inspection has been widely used in the manufacturing process of electronic and communication industries to improve the product quality. In this paper, we develop a three-dimensional inspection and metrology system for semiconductor components with fringe projection profilometry, which is composed of industry camera, telecentric lens and projection module. This system is used to measure the height, flatness, volume, shape, coplanarity for quality checking. To detect the discontinuous parts in the internal surface of semiconductor components, we employ the fringes with multiple spatial frequencies to avoid the measurement ambiguity. The complete three-dimensional information of semiconductor component is obtained by fusing the absolute phase maps from different views. The practical inspection results show that the depth resolution of our system reaches 10 μm . This system can be further embedded for the online inspection of various electronic and communication products.

[1]  Joseph Shamir,et al.  Range Imaging With Adaptive Color Structured Light , 1998, IEEE Trans. Pattern Anal. Mach. Intell..

[2]  Jason Geng,et al.  Structured-light 3D surface imaging: a tutorial , 2011 .

[3]  David R. Burton,et al.  Using coloured structured light in 3-D surface measurement , 2005 .

[4]  J. C. Estrada,et al.  Coherent digital demodulation of single-camera N-projections for 3D-object shape measurement: co-phased profilometry. , 2013, Optics express.

[5]  D. Falie,et al.  Distance errors correction for the Time of Flight (ToF) cameras , 2008, 2008 IEEE International Workshop on Imaging Systems and Techniques.

[6]  Jiangtao Xi,et al.  Shadow removal method for phase-shifting profilometry. , 2015, Applied optics.

[7]  J. Zhong,et al.  Absolute phase-measurement technique based on number theory in multifrequency grating projection profilometry. , 2001, Applied optics.

[8]  Jiangtao Xi,et al.  Frequency selection in absolute phase maps recovery with two frequency projection fringes. , 2012, Optics express.

[9]  Mumin Song,et al.  Overview of three-dimensional shape measurement using optical methods , 2000 .

[10]  G. Häusler,et al.  Laser triangulation: fundamental uncertainty in distance measurement. , 1994, Applied optics.

[11]  J M Huntley,et al.  Temporal phase unwrapping: application to surface profiling of discontinuous objects. , 1997, Applied optics.

[12]  Joaquim Salvi,et al.  Pattern codification strategies in structured light systems , 2004, Pattern Recognit..

[13]  Edmund Y. Lam,et al.  A three-dimensional imaging system for surface profilometry of moving objects , 2013, 2013 IEEE International Conference on Imaging Systems and Techniques (IST).

[14]  Wolfgang Osten,et al.  A robust procedure for absolute phase measurement , 1996 .

[15]  Yi Ding,et al.  Recovering the absolute phase maps of two fringe patterns with selected frequencies. , 2011, Optics letters.

[16]  R. Leach.  Optical measurement of surface topography , 2011 .

[17]  J. M. Huntley,et al.  Temporal phase-unwrapping algorithm for automated interferogram analysis. , 1993, Applied optics.

[18]  Song Zhang,et al.  Phase unwrapping error reduction framework for a multiple-wavelength phase-shifting algorithm , 2009 .

[19]  Qi Hao,et al.  Dual-frequency pattern scheme for high-speed 3-D shape measurement. , 2010, Optics express.

[20]  Richard Szeliski,et al.  A Taxonomy and Evaluation of Dense Two-Frame Stereo Correspondence Algorithms , 2001, International Journal of Computer Vision.