MEMS infrastructure: the multiuser MEMS processes (MUMPs)

In order to help provide access to advanced MEMS technologies, and lower the barriers for both industry and academia, MCNC, and ARPA have developed a program which works to provide users with access to both MEMS processes and advanced integration techniques. The two distinct aspects of this program, the MUMPs and Smart MEMS, will be described in this paper. The multi-user MEMS processes (MUMPs) is an ARPA-supported program created to provide inexpensive access to MEMS technology in a multi-user environment. MUMPs is a proof-of-concept and educational tool to aid the developemnt of MEMS in the domestic community. MUMPs technologies currently include a 3-layer polysilicon surface micromachining process and LIGA processes that provide reasonable design flexibility within set guidelines. Smart MEMS is the development of advanced electronics integration techniques for MEMS through the application of flip chip technology.

[1]  N. Najafi,et al.  An integrated multi-element ultra-thin-film gas analyzer , 1992, Technical Digest IEEE Solid-State Sensor and Actuator Workshop.

[2]  William B Scott,et al.  MICRO-MACHINES HOLD PROMISE FOR AEROSPACE. , 1993 .

[3]  B. Piekarski,et al.  Fluxless soldering in air and nitrogen , 1993, Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).

[4]  Roger T. Howe,et al.  Surface micromachined, digitally force-balanced accelerometer with integrated CMOS detection circuitry , 1992, Technical Digest IEEE Solid-State Sensor and Actuator Workshop.