Failure of electrical vias manufactured in thick-film technology when loaded with short high current pulses

Abstract The high-current failure of electrical interconnects (through-metalized vias) manufactured in thick-film technology is investigated. A large number of vias were measured in a four-wire-setup by applying short time high-current pulses. The experimental conditions ensured that approximately half of the tested vias were destroyed during the tests. The high-current failure mechanism was identified to be a kind of a self-accelerating melting process. It was also implemented in a “Finite Element Method” (FEM)-model. The FEM-model delivered not only the time-dependent voltage drops over the through holes (which is proportional to the through hole resistance), but also the time-dependent temperature, conductivity, and current density distributions inside of the vias during current load. Input parameters for the model were material properties and sample geometries. Analyzed cross-section micrographs of destroyed vias and the temperature maxima received from the FEM-model agreed well. Furthermore, measured and modeled voltage drops during failure were compared and agreed also very well.

[1]  Sunit Rane,et al.  Influence of surfactants treatment on silver powder and its thick films , 2003 .

[2]  N. V. Grevtsev,et al.  Conductor destruction in electrical explosion , 1974 .

[3]  Mark A. Rodriguez,et al.  Behavior of Silver and Palladium Mixtures during Heating , 2004 .

[4]  Maria Prudenziati,et al.  Thick-film technology☆ , 1990 .

[5]  S. S. Cole,et al.  Oxidation and Reduction of Palladium in the Presence of Silver , 1985 .

[6]  Wayne Huebner,et al.  Correlation of Subsolidus Phase Relations in the Ag─Pd─O System to Oxidation Reduction Kinetics and Dilametric Behavior , 1992 .

[7]  Jing-Chie Lin,et al.  On the sintering of mixed and alloyed silver-palladium powders from chemical coprecipitation , 1995 .

[8]  Michael Fischer,et al.  Thick film flow sensor for biological microsystems , 2010 .

[9]  A. W. Schubring,et al.  Wirebonding on multilayer circuits for automotive applications using robust thick-film conductors , 1998 .

[10]  Wenliang Zhu,et al.  Computing method of thermal conductivity of heat dissipation vias in printed circuit board and its optimization , 2015 .

[11]  John H. Lau,et al.  An overview of microvia technology , 2000 .

[12]  Johann Riegel,et al.  Exhaust gas sensors for automotive emission control , 2002 .

[13]  Ralf Moos,et al.  Effect of Repeated Firing on the Resistance of Screen- Printed Thick-Film Conductors , 2014 .

[14]  S. S. Cole,et al.  Sintering of Ag‐Pd in the Presence of a Reactive Glass , 1972 .

[16]  Dwadasi H.R. Sarma,et al.  Emerging Substrate Technologies for Harsh-Environment Automotive Electronics Applications , 2002 .

[17]  Gangqiang Wang,et al.  Fabrication of microvias for multilayer LTCC substrates , 2006, IEEE Transactions on Electronics Packaging Manufacturing.

[18]  J. Whitmarsh,et al.  Evaluating a Thick Film System for All Ag and for Pd/Ag, Au ‘Mixed Metallurgy’ Multilayer Applications , 1995 .

[19]  Ralf Moos,et al.  A Brief Overview on Automotive Exhaust Gas Sensors Based on Electroceramics , 2005 .

[20]  Walter J. Moore.  Grundlagen der Physikalischen Chemie , 1990 .

[21]  W. T. Thompson,et al.  The Ag Pd Silver Palladium System , 1988 .

[22]  R. J. Brook,et al.  Conduction mechanisms in RuO2-glass composites , 1995 .

[23]  D. S. Eddy,et al.  Application of MEMS technology in automotive sensors and actuators , 1998 .

[24]  Marko Hrovat,et al.  Interactions of some thick-film components with alumina substrates , 1989 .

[25]  John G. Pepin,et al.  Silver‐Palladium Thick‐Film Conductors , 1994 .

[26]  E. I. Bichenkov,et al.  Self-similar electrical skin explosion of a conductor , 1969 .

[27]  Leszek Golonka,et al.  The Investigation of Conductive Via Properties , 2015 .

[28]  N. White,et al.  Thick-film sensors : past, present and future , 1997 .

[29]  E. Giani,et al.  Metallisation of Laser‐drilled Holes in 96% Alumina by Screen Printing Mixed‐bonded Pd/Ag: Printing Technology and Reliability of Metallisation , 1991 .

[30]  John G. Pepin,et al.  Subsolidus phase relations in the system Pd-Ag-O and application to multilayer ceramic capacitor electrodes , 1988 .

[31]  Donal Heffernan,et al.  Expanding Automotive Electronic Systems , 2002, Computer.

[32]  G. Becker.  From Soldering Iron to Laser A Review of Soldering Methods for Surface Mounting , 1987 .

[33]  C. D. Breach,et al.  A brief review of selected aspects of the materials science of ball bonding , 2010, Microelectron. Reliab..

[34]  F. P. McCluskey,et al.  Packaging Reliability for High Temperature Electronics: A Materials Focus , 1996 .

[35]  A. W. Szafrański.  Influence of hydrogen on electron transport of palladium alloyed with silver , 2005 .

[36]  Y. C. Chan,et al.  Failure mechanisms of solder interconnects under current stressing in advanced electronic packages , 2010 .

[37]  Ralf Moos,et al.  Investigation of the short-time high-current behavior of vias manufactured in hybrid thick-film technology , 2011, Microelectron. Reliab..

[38]  Sung-Hyun Park,et al.  Sinterability and conductivity of silver paste with Pb-free frit , 2009 .