Novel Active Integrated Antenna Configuration using Multi-Layered Teflon Substrate and Solder Bump Interconnection for Large Scale Array

We propose a novel multi-layered connection method that uses a solder bump on a Teflon substrate. Furthermore, we present the characteristics of the through hole and pin-fed microstrip antenna that are necessary to establish the multi-layered substrate. A prototype antenna of the pin-fed active integrated antenna is presented.