Polyarylenesulfonium Salt as a Novel and Versatile Nonchemically Amplified Negative Tone Photoresist for High-Resolution Extreme Ultraviolet Lithography Applications.

The present report demonstrates the potential of a polyarylenesulfonium polymer, poly[methyl(4-(phenylthio)-phenyl)sulfoniumtrifluoromethanesulfonate] (PAS), as a versatile nonchemically amplified negative tone photoresist for next-generation lithography (NGL) applications starting from i-line (λ ∼ 365 nm) to extreme ultraviolet (EUV, λ ∼ 13.5 nm) lithography. PAS exhibited considerable contrast (γ), 0.08, toward EUV and patterned 20 nm features successfully.

[1]  E. Tsuchida,et al.  Photochemical recycling of polyarylene sulfide , 1996 .

[2]  Yasin Ekinci,et al.  Characterization of extreme ultraviolet resists with interference lithography , 2006 .

[3]  E. Tsuchida,et al.  Synthesis of high-molecular-weight poly(phenylene sulfide) by oxidative polymerization via poly(sulfonium cation) from methyl phenyl sulfoxide , 1993 .

[4]  Kenneth A. Goldberg,et al.  Characterization of the synchrotron-based 0.3 numerical aperture extreme ultraviolet microexposure tool at the Advanced Light Source , 2005 .

[5]  Yayi Wei,et al.  Performance of chemically amplified resists at half-pitch of 45 nm and below , 2007, SPIE Advanced Lithography.

[6]  L Wang,et al.  Single-digit-resolution nanopatterning with extreme ultraviolet light for the 2.5 nm technology node and beyond. , 2015, Nanoscale.

[7]  T. Itani,et al.  Non-Chemically Amplified EUV Resist Based on PHS , 2009 .

[8]  C. Barrios,et al.  Ultrasensitive non-chemically amplified low-contrast negative electron beam lithography resist with dual-tone behaviour , 2013 .

[9]  J. Thackeray Materials challenges for sub-20-nm lithography , 2011 .

[10]  Ivan Pollentier,et al.  Chain scission resists for extreme ultraviolet lithography based on high performance polysulfone-containing polymers , 2011 .

[11]  Ashutosh Sharma,et al.  Sub-40 nm polymer dot arrays by self-organized dewetting of electron beam treated ultrathin polymer films , 2012 .

[12]  Richard A. Lawson,et al.  High sensitivity nonchemically amplified molecular resists based on photosensitive dissolution inhibitors , 2010 .

[13]  Yasin Ekinci,et al.  Photolithographic properties of tin-oxo clusters using extreme ultraviolet light (13.5 nm) , 2014 .

[14]  Edwin L. Thomas,et al.  Microdomain patterns from directional eutectic solidification and epitaxy , 2000, Nature.

[15]  Markos Trikeriotis,et al.  A new inorganic EUV resist with high-etch resistance , 2012, Advanced Lithography.

[16]  Mark Neisser,et al.  ITRS lithography roadmap: 2015 challenges , 2015 .

[17]  Li Li,et al.  Studying the Mechanism of Hybrid Nanoparticle Photoresists: Effect of Particle Size on Photopatterning , 2015 .

[18]  Kenneth A. Goldberg,et al.  Critical challenges for EUV resist materials , 2011, Advanced Lithography.

[19]  Mingxing Wang,et al.  Novel polymeric anionic photoacid generators (PAGs) and corresponding polymers for 193 nm lithography , 2006 .

[20]  K. Gonsalves,et al.  Patterning highly ordered arrays of complex nanofeatures through EUV directed polarity switching of non chemically amplified photoresist , 2016, Scientific Reports.

[21]  S. Moon,et al.  Chemistry of photolithographic imaging materials based on the chemical amplification concept , 2008 .

[22]  Subrata Ghosh,et al.  Radiation-sensitive novel polymeric resist materials: iterative synthesis and their EUV fragmentation studies. , 2014, ACS applied materials & interfaces.

[23]  Subrata Ghosh,et al.  Recent advances in non-chemically amplified photoresists for next generation IC technology , 2016 .

[24]  Yasin Ekinci,et al.  High-sensitivity molecular organometallic resist for EUV (MORE) , 2015, Advanced Lithography.

[25]  E. Tsuchida,et al.  Synthesis and photochemical reaction of polyarylenesulfonium salts , 1999 .

[26]  Witold Abramowicz,et al.  Challenges , 2007, Prehospital and Disaster Medicine.