IoT-Based Degradation Management for Self-Healing Power Converters

In high power applications, medium voltage (MV) power converters have proven to be the best solution for dealing with large amounts of energy, reducing power losses and decreasing costs. The importance of such equipment has placed its service continuity as the most relevant concern for researchers and engineers. In this work an IoT scheme is proposed to remotely manage the remaining useful life of IGBT power modules based on their failure precursors. The proposed structure was designed to permit remote and automatic actuation in the power converter according to the degradation levels of its power devices.

[1]  Dehong Xu,et al.  Survey on Fault-Tolerant Techniques for Power Electronic Converters , 2014, IEEE Transactions on Power Electronics.

[2]  Stig Munk-Nielsen,et al.  Vce as early indicator of IGBT module failure mode , 2017, 2017 IEEE International Reliability Physics Symposium (IRPS).

[3]  Xinghuo Yu,et al.  An Improved Virtual Space Vector Modulation Scheme for Three-Level Active Neutral-Point-Clamped Inverter , 2017, IEEE Transactions on Power Electronics.

[4]  Samuel H. Huang,et al.  System health monitoring and prognostics — a review of current paradigms and practices , 2006 .

[5]  Bilal Akin,et al.  A comprehensive study on variations of discrete IGBT characteristics due to package degradation triggered by thermal stress , 2016, 2016 IEEE Energy Conversion Congress and Exposition (ECCE).

[6]  Stig Munk-Nielsen,et al.  Improving Power Converter Reliability: Online Monitoring of High-Power IGBT Modules , 2014, IEEE Industrial Electronics Magazine.

[7]  Michael G. Pecht,et al.  A fusion prognostics method for remaining useful life prediction of electronic products , 2009, 2009 IEEE International Conference on Automation Science and Engineering.

[8]  M. Pecht,et al.  A fusion approach to IGBT power module prognostics , 2009, EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

[9]  Decai Yang Physics-of-failure-based prognostics and health management for electronic products , 2014, 2014 15th International Conference on Electronic Packaging Technology.

[10]  Stéphane Lefebvre,et al.  Degradation behavior of 600 V-200 A IGBT modules under power cycling and high temperature environment conditions , 2007, Microelectron. Reliab..

[11]  Sidelmo M. Silva,et al.  A new fault-tolerant realization of the active three-level NPC converter , 2014, 2014 IEEE Energy Conversion Congress and Exposition (ECCE).

[12]  Yi Deng,et al.  Improved Modulation Scheme for Loss Balancing of Three-Level Active NPC Converters , 2017, IEEE Transactions on Power Electronics.

[13]  Dimitris Rizopoulos,et al.  Joint Models for Longitudinal and Time-to-Event Data: With Applications in R , 2012 .

[14]  Xue-feng Yan,et al.  Fault Detection and Diagnosis in Chemical Processes Using Sensitive Principal Component Analysis , 2013 .

[15]  Mauro Ciappa,et al.  Selected failure mechanisms of modern power modules , 2002, Microelectron. Reliab..

[16]  Hans Wortmann,et al.  Evaluating condition based maintenance effectiveness for two processes in series , 2011 .

[17]  Peter Tavner,et al.  Condition Monitoring for Device Reliability in Power Electronic Converters: A Review , 2010, IEEE Transactions on Power Electronics.

[18]  Michael G. Pecht,et al.  Health Monitoring of Cooling Fans Based on Mahalanobis Distance With mRMR Feature Selection , 2012, IEEE Transactions on Instrumentation and Measurement.

[19]  M. Porter,et al.  How Smart, Connected Products Are Transforming Companies , 2015 .

[20]  Brian A. Weiss,et al.  A review of diagnostic and prognostic capabilities and best practices for manufacturing , 2019, J. Intell. Manuf..

[21]  T. Bruckner,et al.  Loss balancing in three-level voltage source inverters applying active NPC switches , 2001, 2001 IEEE 32nd Annual Power Electronics Specialists Conference (IEEE Cat. No.01CH37230).

[22]  Anant S. Kamath,et al.  Aging Precursor Identification and Lifetime Estimation for Thermally Aged Discrete Package Silicon Power Switches , 2017, IEEE Transactions on Industry Applications.

[23]  Jay Lee,et al.  Watchdog Agent - an infotronics-based prognostics approach for product performance degradation assessment and prediction , 2003, Adv. Eng. Informatics.

[24]  Myeongsu Kang,et al.  A fusion prognostics-based qualification test methodology for microelectronic products , 2016, Microelectron. Reliab..

[25]  P. Lall,et al.  Prognostics and health management of electronics , 2006, 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface.

[26]  Fei Qin,et al.  Numerical simulation of the wire bonding reliability of IGBT module under power cycling , 2017, 2017 18th International Conference on Electronic Packaging Technology (ICEPT).

[27]  Michael G. Pecht,et al.  Considerations in implementing canary based prognostics , 2015, 2015 IEEE Conference on Prognostics and Health Management (PHM).

[28]  Michael G. Pecht,et al.  IoT-Based Prognostics and Systems Health Management for Industrial Applications , 2016, IEEE Access.

[29]  Michael Pecht,et al.  Predicting the reliability of electronic equipment , 1994 .

[30]  Venkat Venkatasubramanian,et al.  Prognostic and diagnostic monitoring of complex systems for product lifecycle management: Challenges and opportunities , 2005, Comput. Chem. Eng..

[31]  Mohammad Modarres,et al.  A probabilistic physics-of-failure model for prognostic health management of structures subject to pitting and corrosion-fatigue , 2011, Reliab. Eng. Syst. Saf..

[32]  Lei Xu,et al.  Health management based on fusion prognostics for avionics systems , 2011 .

[33]  Frede Blaabjerg,et al.  Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics , 2014, IEEE Journal of Emerging and Selected Topics in Power Electronics.

[34]  F. Jovane,et al.  Present and future of flexible automation: Towards new paradigms , 2003 .

[35]  Huai Wang,et al.  Impact of lifetime model selections on the reliability prediction of IGBT modules in modular multilevel converters , 2017, 2017 IEEE Energy Conversion Congress and Exposition (ECCE).

[36]  O. Alatise,et al.  Experimental Investigation on the Effects of Narrow Junction Temperature Cycles on Die-Attach Solder Layer in an IGBT Module , 2017, IEEE Transactions on Power Electronics.