Microelectronics Packaging

[1]  Krishna Shenai,et al.  Framework for power package design and optimization , 1998, IWIPP Proceedings. IEEE International Workshop on Integrated Power Packaging (Cat. No.98EX203).

[2]  Krishna Shenai,et al.  Measurement of thermal and packaging limitations in LDMOSFETs for RFIC applications , 1998, IMTC/98 Conference Proceedings. IEEE Instrumentation and Measurement Technology Conference. Where Instrumentation is Going (Cat. No.98CH36222).

[3]  Yasuhisa Yamaji,et al.  Development of highly reliable CSP , 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

[4]  A. Elshabini-Riad,et al.  Plastic packaging modeling and characterization at RF/microwave frequencies , 1997, Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces.

[5]  R. W. Jackson,et al.  A circuit topology for microwave modeling of plastic surface mount packages , 1996 .

[6]  M. Gomes-Casseres,et al.  Thermally enhanced plastic packages using diamond for microwave applications , 1996, 1996 IEEE MTT-S International Microwave Symposium Digest.

[7]  Linda P. B. Katehi,et al.  Advanced monolithic packaging concepts for high performance circuits and antennas , 1996, 1996 IEEE MTT-S International Microwave Symposium Digest.

[8]  T. A. Midford,et al.  The evolution of packages for monolithic microwave and millimeter-wave circuits , 1995 .

[9]  C. R. Smith,et al.  Power module technology for the 21st century , 1995, Proceedings of the IEEE 1995 National Aerospace and Electronics Conference. NAECON 1995.

[10]  J.L. Bugeau,et al.  Aluminum silicon carbide for high performance microwave packages , 1995, Proceedings of 1995 IEEE MTT-S International Microwave Symposium.

[11]  L.P.B. Katehi,et al.  Micromachined conformal packages for microwave and millimeter-wave applications , 1995, Proceedings of 1995 IEEE MTT-S International Microwave Symposium.

[12]  R. T. Kemerley,et al.  Emerging microwave packaging technologies , 1994, Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging.

[13]  D. Wein.  Advanced ceramic packaging for microwave and millimeter wave applications , 1993, Proceedings of IEEE Antennas and Propagation Society International Symposium.

[14]  M. Horn,et al.  Electronic packaging in the 1990s: the perspective from Europe , 1990 .

[15]  Rao Tummala,et al.  Electronic packaging in the 1990s-a perspective from America , 1990 .

[16]  T. Sudo,et al.  Considerations on package design for high speed and high pin count CMOS devices , 1989, Proceedings., 39th Electronic Components Conference.

[17]  Brian Bakoglu,et al.  Packaging for High-Speed Systems , 1988 .

[18]  N. Teneketges,et al.  Multichip Packaging Design for VLSI-Based Systems , 1987 .

[19]  I. Fukuzawa,et al.  Moisture Resistance Degradation of Plastic LSIs by Reflow Soldering , 1985, 23rd International Reliability Physics Symposium.

[20]  C. Huang,et al.  Silicon-On-Silicon Packaging , 1984 .

[21]  M. L. White,et al.  Attaining Low Moisture Levels in Hermetic Packages , 1982, 20th International Reliability Physics Symposium.

[22]  N. Shigyo,et al.  Coupling capacitances for two-dimensional wires , 1981, IEEE Electron Device Letters.

[23]  H. R. Kaupp,et al.  Characteristics of Microstrip Transmission Lines , 1967, IEEE Trans. Electron. Comput..

[24]  R. C. Chu,et al.  Conduction cooling for an LSI package: a one-dimensional approach , 1982 .