Resistance Scaling of Cu Interconnect and Alternate Metal (Co, Ru) Benchmark toward sub 10nm Dimension
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J. Tseng | M. Naik | He Ren | R. Shaviv | Xiangjin Xie | W. Lei | K. Kashefizadeh | Zhiyuan Wu | M. Gage | Nikos Bekiaris | G. How | R. Tao | Joung Joo Lee | R. Vinnakota