Reliability Tests and Data Analyses of Solder Joints
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[1] Narendra J. Sheth,et al. Statistical Design and Analysis of Engineering Experiments , 1973 .
[2] John Arthur,et al. Solder-Joint Reliability of BGA Packages in Automotive Applications , 2019 .
[3] J. Lau,et al. Characteristics and Reliability of No-Flow Underfills for Solder Bumped Flip Chip Assemblies , 1999 .
[4] J. Lau,et al. Design for lead‐free solder joint reliability of high‐density packages , 2004 .
[5] John H. Lau,et al. Reliability of Lead-Free Solder Joints , 2006 .
[6] J. Lau,et al. Modeling and analysis of 96.5Sn-3.5Ag lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board , 2002 .
[7] J. Lau,et al. Design for Plastic Ball Grid Array Solder Joint Reliability , 1997 .
[8] J. H. Lau,et al. Failure analysis of solder bumped flip chip on low-cost substrates , 2000 .
[9] J. Lau,et al. Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies , 1996 .
[10] Dana Crowe,et al. Design for Reliability , 2001 .
[11] J. Radhakrishnan. Effect of board and package attributes on solder joint reliability of FCBGA packages based on IPC9701 characterization , 2008, 2008 58th Electronic Components and Technology Conference.
[12] John H. Lau,et al. Design, materials and process for lead‐free assembly of high‐density packages , 2004 .
[13] John H. Lau,et al. Reliability of an 1657CCGA (Ceramic Column Grid Array) Package With 95.5SN3.9AG0.6CU Lead-Free Solder Paste on PCBS (Printed Circuit Boards) , 2005 .
[14] Xuejun Fan,et al. An acceleration model for lead-free (SAC) solder joint reliability under thermal cycling , 2008, 2008 58th Electronic Components and Technology Conference.
[15] David J Smith,et al. Reliability, Maintainability and Risk , 2013 .
[16] P. Vianco,et al. Acceleration models, constitutive equations, and reliability of lead-free solders and joints , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..
[17] W. Weibull. A Statistical Distribution Function of Wide Applicability , 1951 .
[18] Sigmund J. Amster,et al. The Statistical Treatment of Fatigue Experiments , 1964 .
[19] J. Lau,et al. Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board , 2000, Packaging of Electronic and Photonic Devices.
[20] J. H. Lau,et al. Shock and Vibration of Solder Bumped Flip Chip on Organic Coated Copper Boards , 1996 .
[21] Charles E Ebeling,et al. An Introduction to Reliability and Maintainability Engineering , 1996 .
[22] N. Lee,et al. Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging , 2017 .
[23] Pradeep Lall,et al. Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics , 2012 .
[24] Lev M. Klyatis,et al. Accelerated Reliability and Durability Testing Technology , 2012 .
[25] Niall Murphy,et al. Site Reliability Engineering: How Google Runs Production Systems , 2016 .
[26] J. Lau,et al. Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting,and Vibration Conditions , 1996 .
[27] J. Lau,et al. Reliability of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Re-Distributed Layers , 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
[28] J. Lau,et al. Effects of aging and underfills on mechanical-drop tests of SnAgCu PBGA (plastic ball grid array) packages on ImAg PCB (printed circuit board) , 2007, International Conference on Electronic Materials and Packaging.
[29] John H. Lau,et al. Reliability testing and data analysis of lead‐free solder joints for high‐density packages , 2004 .
[30] J. Lau,et al. Effects of Underfills on the Thermal-Cycling Tests of SnAgCu PBGA (Plastic Ball Grid Array) Packages on ImAg PCB (Printed Circuit Board) , 2007, Electronic Packaging Technology Conference.
[31] J. McPherson. Reliability Physics and Engineering , 2010 .
[32] J. Pang,et al. Bulk solder and solder joint properties for lead free 95.5Sn-3.8Ag-0.7Cu solder alloy , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..
[34] J. Wolfowitz,et al. Introduction to the Theory of Statistics. , 1951 .
[35] M. Collins,et al. Improved Reliability and Mechanical Performance of Ag Microalloyed Sn58Bi Solder Alloys , 2019, Metals.
[36] Dev G. Raheja,et al. Design for Reliability: Raheja/Design for Reliability , 2012 .
[37] Guangbin Yang. Life cycle reliability engineering , 2007 .
[38] A. K. S. Jardine,et al. Maintenance, Replacement, and Reliability , 2021 .
[39] Mohammad Modarres. Reliability engineering and risk analysis , 1999 .
[40] Michael Havbro Faber,et al. Statistics and Probability Theory , 2012 .
[41] Marvin Rausand,et al. System Reliability Theory , 2020, Wiley Series in Probability and Statistics.
[42] P. O'Connor,et al. Practical Reliability Engineering , 1981 .
[43] John H. Lau,et al. Failure analysis of lead‐free solder joints for high‐density packages , 2004 .
[44] Patrick D. T. O'Connor,et al. Practical Reliability Engineering: O'Connor/Practical Reliability Engineering , 2011 .
[45] Indra Gunawan,et al. Fundamentals of Reliability Engineering: Applications in Multistage Interconnection Networks , 2014 .
[46] Eugene L. Grant,et al. Statistical Quality Control , 1946 .
[47] Roger M. Cooke,et al. Probabilistic Risk Analysis: Probabilistic risk analysis , 2001 .
[48] John H. Lau,et al. Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution-Layers (RDLs) , 2017 .
[49] Hoang Pham,et al. Reliability Modeling, Analysis and Optimization , 2006, Series on Quality, Reliability and Engineering Statistics.
[50] W. R. Buckland,et al. Theory and Technique of Variation Research. , 1965 .
[51] Hoang Pham,et al. Handbook of reliability engineering , 2013 .