Reliability Tests and Data Analyses of Solder Joints

Reliability engineering consists of three major tasks [1–14], namely, design for reliability (DFR), reliability testing and data analysis, and failure analysis, as schematically shown in Fig. 6.1. Usually, the procedure starts with a design of the interconnects of a particular semiconductor IC (integrated circuit) package with, e.g., the given chip size, the solder alloys, the molding compound, and the corresponding PCB (printed circuit board) and demonstrates that the design is electrically, thermally, mechanically, and chemically sound. As an example, the DFR activity is often performed with a finite-element simulation using the structural geometry, material properties of all the structural elements and the imposed boundary conditions. The next step in the process is for a certain number of samples of the sound or reliable design to be built and tested under certain conditions for a certain period of time. The test data (failures) then are analyzed and fitted into a life-distribution designation for the interconnects. Failure analysis then should be done on the failed samples to find out the root cause and understand the reason for their failure. In this chapter, reliability testing and data analysis will be discussed and demonstrated through examples. The DFR and failure analysis will be discussed in the next chapters. The definition of reliability will be briefly mentioned first in this chapter.

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