Electrical Resistivity and Morphology of Sn 1− x /Si x Core–Shell Cluster Network Prepared by a Plasma-Gas-Condensation Cluster Source

Sn11x/Six cluster assembled films have been prepared by a plasma-gas-condensation cluster beam deposition apparatus. Transmission electron microscope images indicate that individual clusters have core­shell morphology, where Sn cores are covered by Si shells. Temperature dependence of electrical resistivity exhibits a metallic behavior and a superconducting transition at low temperature for 0 0.29. These results indicate that the cluster network and/or core­shell morphology Sn11x/Six cluster assembled films changes with x. [doi:10.2320/matertrans.M2012232]

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