Achieving Fast and Reliable TEM-Sample Lift-out and Transfer Using Novel Materials and Novel in-situ Tools

quently, a patch of tungsten or platinum metal is deposited, fixing the needle to the previously cut lamella. Then the lamella is lifted away from the substrate and attached to a TEM-grid for further processing [1, 2]. The first improvement on the established method is to replace this step with a simple, cleaner and more reliable one. Using tungsten probes which are precisely aligned and mounted to a piezo driving Received: October 30, 2008 Accepted: December 4, 2008