ESD protection devices placed inside keep-out zone (KOZ) of through Silicon Via (TSV) in 3D stacked integrated circuits
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Steven Thijs | G. Hellings | D. Linten | G. Groeseneken | M. Scholz | Shih-Hung Chen | D. Linten | G. Groeseneken | Shih-Hung Chen | G. Hellings | M. Scholz | S. Thijs
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