An efficient method to evaluate 4 million micro-bump interconnection resistances for 3D stacked 16-mpixel image sensor
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Yoshiaki Takemoto | Naohiro Takazawa | Mitsuhiro Tsukimura | Haruhisa Saito | Hideki Kato | Jun Aoki | Shunsuke Suzuki | Yuichi Gomi | Seisuke Matsuda | Yoshitaka Tadaki | Kenji Kobayashi | Torn Kondo
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