Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Applications Using a Laser Ultrasound Inspection System
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I. C. Ume | Jin Yang | Lizheng Zhang | C. Ghiu | G. White
[1] Janet E. Semmens. Flip chips and acoustic micro imaging: An overview of past applications, present status, and roadmap for the future , 2000 .
[2] A. Hasan,et al. High performance package designs for a 1 GHz microprocessor , 2001 .
[3] Sheng Liu,et al. A novel approach for flip chip solder joint quality inspection: laser ultrasound and interferometric system , 2001 .
[4] I. Charles Ume,et al. Inspection of flip chip and chip scale package interconnects using laser ultrasound and interferometric techniques , 2002 .
[5] Wei Ren,et al. Transition to Pb-free manufacturing using land grid array packaging technology , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
[6] I. C. Ume,et al. Online-offline laser ultrasonic quality inspection tool for multi-layer chip capacitors , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).
[7] John S. Corbin,et al. Land grid array sockets for server applications , 2002, IBM J. Res. Dev..
[8] Sheng Liu,et al. Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System , 2003 .
[9] Chien Chen Lee,et al. Thermal performance and solder joint reliability for board level assembly of modified leadframe package , 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
[10] Y.P. Zhang,et al. Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers , 2005, IEEE Transactions on Antennas and Propagation.
[11] Tong Yan Tee,et al. Board-level solder joint reliability analysis of thermally enhanced BGAs and LGAs , 2006, IEEE Transactions on Advanced Packaging.
[12] Zhaowei Zhong,et al. Board-level solder joint reliability analysis of thermally enhanced BGAs and LGAs , 2006 .
[13] Lizheng Zhang,et al. Detection of flip chip solder joint cracks using correlation coefficient and auto-comparison analyses of laser ultrasound signals , 2006, IEEE Transactions on Components and Packaging Technologies.