Issues in low-cost manufacture of reliable optoelectronic systems
暂无分享,去创建一个
A product with high assembly efficiency will, in general, have a low defect count. So, it may be expected that the application of DFA would improve the reliability of optoelectronic systems. Nevertheless, detailed reliability assessment of the product is necessary during the product design and development phase either to compare alternate designs or to assess potential reliability problems in a candidate design. The procedures for such a reliability assessment are discussed. The reliability of the "electronics" in an optoelectronic system is typically a function of component, interconnection, board, and subassembly reliabilities.
[1] Geoffrey Boothroyd,et al. Product design for manufacture and assembly , 1994, Comput. Aided Des..
[2] H. W. Stoll. Design for Manufacture: An Overview , 1986 .
[3] J. B. Bowles,et al. A survey of reliability-prediction procedures for microelectronic devices , 1992 .
[4] Michael Pecht,et al. A critique of Mil-Hdbk-217E reliability prediction methods , 1988 .