Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards

Modern electronic products are becoming lighter in weight and smaller in size as well as its increasing functionality. They are often experiencing the severe vibration and shock environments in many applications. Drop/impact tolerance, or the ability to safely withstand accidental drop/impact, is becoming an increasingly important aspect of the reliability of electronic products. And shock analysis and corresponding protection methods are quite meaningful to the development of electronic products. Thus, the objective of this work is to realize quick drop-impact analysis of packaged electronic products. The focus of this work is to develop a full-scale virtual buffer model to realize a high efficient analysis for large-scale packaged electronic product model. Two steps are performed to achieve this virtual buffer model: first, establish virtual buffer model; second, create objective model and incorporate into virtual buffer model. The proposed local linearization method is contributed to the establishment of virtual buffer model. This work can save the computational time on buffer modeling and contact simulation. In addition, the hybrid laminate modeling method is applied in the creation of multilayer circuit board, which is objective model in the virtual buffer model. For complex multilayer model, the hybrid laminate modeling method can realize high-efficient two-dimensional simulations without numerous simulations of three-dimensional unit-cell model and laborious physical measurement of various material properties. We conclude that virtual buffer model provides a platform for the applicaii ATTENTION: The Singapore Copyright Act applies to the use of this document. Nanyang Technological University Library