3D Group-Cross Symmetrical Interleaved Inductor in Advanced 45 nm RF CMOS Technology: A New Compact Inductor Architecture improving Self-Resonance Frequency

High Performance on-chip inductor is a key enabling element of monolithic RF circuits and radio frequency (RF) system-on-chip. Generally, on chip inductor are planar devices but 3D symmetrical spiral interleaved inductor (3DSII) has been proposed (1) to lower the amount of area consumed by inductor. This paper presents a novel 3D group-cross symmetrical spiral interleaved inductor (3DGCSII), which has higher self-resonance frequency (SRF) and occupies the same layout area as 3DSII. Measurement data of 3DGCSI and 3DSII, achieved using STMicroelectronics Low Power 45 nm RF CMOS technology, are here compared with each other to show the advantages of this new inductor structure.

[1]  Zheng-Fan Li,et al.  Group-cross symmetrical inductor (GCSI): a new inductor structure with higher self-resonance frequency and Q factor , 2006, IEEE Transactions on Magnetics.

[2]  D. Gloria,et al.  High frequency low noise potentialities of down to 65 nm technology nodes MOSFETs , 2005, European Gallium Arsenide and Other Semiconductor Application Symposium, GAAS 2005.

[3]  F. Gianesello,et al.  3D group-cross symmetrical inductor: A new inductor architecture with higher self-resonance frequency and Q factor dedicated to advanced HR SOI CMOS technology , 2008, 2008 IEEE Radio Frequency Integrated Circuits Symposium.

[4]  Liang-Hung Lu,et al.  High-performance three-dimensional on-chip inductors in SOI CMOS technology for monolithic RF circuit applications , 2003, IEEE MTT-S International Microwave Symposium Digest, 2003.

[5]  F. Gianesello,et al.  On the Design of High Performance RF Integrated Inductors on High Resistively Thin Film 65 nm SOI CMOS Technology , 2008, 2008 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.

[6]  G. Chien,et al.  World's First 90nm CMOS Single-Chip Bluetooth and WLAN with Integrated RF , 2007, 2007 International Symposium on Integrated Circuits.

[7]  Liang-Hung Lu,et al.  High-performance three-dimensional on-chip inductors in SOI CMOS technology for monolithic RF circuit applications , 2003, IEEE Radio Frequency Integrated Circuits (RFIC) Symposium, 2003.