Excimer laser formed vertical links of standard CMOS double-level metallizations

Excimer-laser-formed vertical links between two metallization levels are demonstrated on special test chips, fabricated by ES2 in a standard CMOS process. Yield is 100% using link structures of 20 mu m*20 mu m and 14 mu m*14 mu m linear dimension and two identical laser pulses. Mean contact resistance is less than 200 Omega . A new test chip is built using sandwich layers for metallization and spin-on glass planarization. Temperature and humidity cycling of processed antifuses was carried out.<<ETX>>

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