Effects of Silver‐Paste Formulation on Camber Development during the Cofiring of a Silver‐Based, Low‐Temperature‐Cofired Ceramic Package

The effects of silver-paste formulation on camber development during the cofiring of a two-layered structure of a silver-based, low-temperature-cofired ceramic (LTCC) system have been investigated. The densification kinetics and mechanism of the silver film become more similar to that of LTCC as the amount of LTCC powder in the silver paste increases, which results in a smaller camber during cofiring. By using the densification results of silver film and LTCC, camber development during cofiring can be mathematically described by using viscous analysis, which agrees well with the experimental observations.

[1]  J. Mackenzie,et al.  The Elastic Constants of a Solid containing Spherical Holes , 1950 .

[2]  J. Mackenzie,et al.  A Phenomenological Theory of Sintering , 1949 .

[3]  R. Raj,et al.  Flaw Generation During Constrained Sintering of Metal-Ceramic and Metal–Glass Multilayer Films , 1989 .

[4]  J. Jean,et al.  Effect of Densification Mismatch on Camber Development during Cofiring of Nickel‐Based Multilayer Ceramic Capacitors , 2005 .

[5]  D. Turnbull,et al.  Lattice and Grain Boundary Self‐Diffusion in Silver , 1951 .

[6]  J. Knickerbocker Overview of the glass-ceramic/copper substrate - a high-performance multilayer package for the 1990s , 1992 .

[7]  Rao Tummala,et al.  Ceramic and Glass‐Ceramic Packaging in the 1990s , 1991 .

[8]  Y. Shimada,et al.  Low dielectric constant multilayer glass-ceramic substrate with Ag-Pd wiring for VLSI package , 1988 .

[9]  G. Scherer,et al.  On constrained sintering-II. Comparison of constitutive models , 1988 .

[10]  Hideo Takamizawa,et al.  Low Firing Temperature Multilayer Glass-Ceramic Substrate , 1983 .

[11]  J. Frenkel Viscous Flow of Crystalline Bodies under the Action of Surface Tension , 1945 .

[12]  Rajendra K. Bordia,et al.  On constrained sintering—I. Constitutive model for a sintering body , 1988 .

[13]  G. Lu,et al.  Effect of Mismatched Sintering Kinetics on Camber in a Low‐Temperature Cofired Ceramic Package , 1993 .

[14]  Jau-Ho Jean,et al.  Camber development during cofiring Ag-based low-dielectric-constant ceramic package , 1997 .

[15]  Jau-Ho Jean,et al.  Cofiring Kinetics and Mechanisms of an Ag-Metallized Ceramic-Filled Glass Electronic Package , 2005 .

[16]  G. Scherer Sintering inhomogeneous glasses: Application to optical waveguides , 1979 .

[17]  R. Raj,et al.  Sintering Behavior of Ceramic Films Constrained by a Rigid Substrate , 1985 .

[18]  T. Gupta,et al.  Principles of the development of a silica dielectric for microelectronics packaging , 1996 .

[19]  V. A. Ivensen Phenomenological Theory of Sintering , 1973 .

[20]  A. Evans,et al.  Residual Stresses and Cracking in Metal/Ceramic Systems for Microelectronics Packaging , 1985 .

[21]  I. Cutler Sintering of Glass Powders During Constant Rates of Heating , 1969 .

[22]  Jau-Ho Jean,et al.  Design of low dielectric glass+ceramics for multilayer ceramic substrate , 1994 .