Self-alignment of RFID dies on four-pad patterns with water droplet for sparse self-assembly
暂无分享,去创建一个
[1] R. Howe,et al. Modeling of capillary forces and binding sites for fluidic self-assembly , 2001, Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090).
[2] Dung-An Wang,et al. Shaking assisted self-assembly of rectangular-shaped parts , 2010 .
[3] M Mastrangeli,et al. Challenges for Capillary Self-Assembly of Microsystems , 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[4] K.F. Bohringer,et al. A fully dry self-assembly process with proper in-plane orientation , 2008, 2008 IEEE 21st International Conference on Micro Electro Mechanical Systems.
[5] Heiko O. Jacobs,et al. Self-assembly of microscopic chiplets at a liquid–liquid–solid interface forming a flexible segmented monocrystalline solar cell , 2010, Proceedings of the National Academy of Sciences.
[6] Quan Zhou,et al. Development of a flexible force-controlled piezo-bimorph microgripping system , 2003 .
[7] Yutaka Ohno,et al. Direct integration of GaAs HEMTs on AlN ceramic substrates using fluidic self-assembly , 2005 .
[8] R. Howe,et al. Microstructure to substrate self-assembly using capillary forces , 2001 .
[9] Kenneth Y. Goldberg,et al. Parallel microassembly with electrostatic force fields , 1998, Proceedings. 1998 IEEE International Conference on Robotics and Automation (Cat. No.98CH36146).
[10] Akira Shimokohbe,et al. Self-alignment of microparts using liquid surface tension—behavior of micropart and alignment characteristics , 2003 .
[11] Xiaorong Xiong,et al. Towards optimal designs for self-alignment in surface tension driven micro-assembly , 2004, 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest.
[12] C. Van Hoof,et al. Lateral capillary forces of cylindrical fluid menisci: a comprehensive quasi-static study , 2010 .
[13] J. Andrew Yeh,et al. Self-alignment of microchips using surface tension and solid edge , 2007 .
[14] Jean-Pierre Celis,et al. Conformal dip-coating of patterned surfaces for capillary die-to-substrate self-assembly , 2009 .
[15] K. L. Scott,et al. High-performance inductors using capillary based fluidic self-assembly , 2004, Journal of Microelectromechanical Systems.
[16] Quan Zhou,et al. Hybrid Microassembly Combining Robotics and Water Droplet Self-Alignment , 2010, IEEE Transactions on Robotics.
[17] Clifton G. Fonstad. Magnetically-Assisted Statistical Assembly - a new heterogeneous integration technique , 2002 .
[18] Fan-Gang Tseng,et al. Orientation-specific fluidic self-assembly process based on a capillary effect , 2009 .
[19] Fan-Gang Tseng,et al. Studies on Size and Lubricant Effects for Fluidic Self-Assembly of Microparts on Patterned Substrate Using Capillary Effect , 2008 .
[20] Goldberg,et al. Genetic algorithms , 1993, Robust Control Systems with Genetic Algorithms.
[21] Modeling of Fluidic Self-Assembly for Integration of Silicon Components on Plastic , 2006, 19th IEEE International Conference on Micro Electro Mechanical Systems.
[22] Nikolaos Aspragathos,et al. Electrostatic attraction and surface-tension-driven forces for accurate self-assembly of microparts , 2010 .
[23] Quan Zhou,et al. Self-alignment in the stacking of microchips with mist-induced water droplets , 2011 .
[24] Kenneth A. Brakke,et al. The Surface Evolver , 1992, Exp. Math..
[25] David E. Goldberg,et al. Genetic Algorithms in Search Optimization and Machine Learning , 1988 .
[26] Y. C. Chan,et al. Study of the self-alignment of no-flow underfill for micro-BGA assembly , 2001, Microelectron. Reliab..
[27] Karl F. Böhringer,et al. Parallel micro component-to-substrate assembly with controlled poses and high surface coverage , 2006 .
[28] Babak A. Parviz,et al. Self-assembled crystalline semiconductor optoelectronics on glass and plastic , 2008 .
[29] H. Yeh,et al. Fluidic self-assembly for the integration of GaAs light-emitting diodes on Si substrates , 1994, IEEE Photonics Technology Letters.
[30] Wei Zheng,et al. Shape-and-solder-directed self-assembly to package semiconductor device segments , 2004 .
[31] Jiandong Fang,et al. Wafer-level packaging based on uniquely orienting self-assembly (the DUO-SPASS processes) , 2006 .
[32] Mei Liu,et al. On-demand multi-batch self-assembly of hybrid MEMS by patterning solders of different melting points , 2007 .
[33] Quan Zhou,et al. Capillary-driven self-assembly of microchips on oleophilic/oleophobic patterned surface using adhesive droplet in ambient air , 2011 .
[34] H. Fujita,et al. Alternative approach in 3D MEMS-IC integration using fluidic self-assembly techniques , 2009 .