论文信息 - A Bandwidth-Dense, Low Power Electronic-Photonic Platform and Architecture for Multi-Tbps Optical I/O

A Bandwidth-Dense, Low Power Electronic-Photonic Platform and Architecture for Multi-Tbps Optical I/O

We present a high bandwidth-density photonic interconnect platform that transmits 1.05 Tbps/mm2 using 0.83 pJ/bit, integrated in a 45nm SOI process, and a high-density multi-wavelength laser source.

[1] Rajeev J. Ram,et al. Single-chip microprocessor that communicates directly using light , 2015, Nature.

[2] Chen Sun,et al. WaveLight: A Monolithic Low Latency Silicon-Photonics Communication Platform for the Next-Generation Disaggregated Cloud Data Centers , 2017, 2017 IEEE 25th Annual Symposium on High-Performance Interconnects (HOTI).