论文信息 - Microstructure evolution and resistivity of Cu(B) alloy films on Ti underlayer at the early stage of annealing at 500°C - 字舞流文

Microstructure evolution and resistivity of Cu(B) alloy films on Ti underlayer at the early stage of annealing at 500°C

D. Kim | H. Ruh | J. Lee | C. Jeong | J. H. Lee | D. Han | E. G. Lee | J. Lee | S. Lee | T. Hong | C. Kang