Modeling and characterization of CNT-based TSV for high frequency applications

This paper presents modeling and characterization of CNT-based TSVs for high frequency applications. We have developed an integrated model of CNT-based TSVs by incorporating quantum confinement effects of CNTs along with kinetic inductance phenomenon at high frequencies. Substrate parasitics have been appropriately modeled as monolithic microwave capacitor by resonant line technique using a two-polynomial equation. Different parametric variations in the model have been outlined as case studies. Furthermore, electrical performance and signal integrity analysis on different cases have been used to determine optimized configuration for TSV-based CNTs for radar applications.

[1]  P. Burke.  Luttinger liquid theory as a model of the gigahertz electrical properties of carbon nanotubes , 2002 .

[2]  Thomas M. Weller,et al.  A substrate-dependent CAD model for ceramic multilayer capacitors , 2000 .

[3]  R. T. Jacobsen,et al.  High-Frequency Measurement of Q-Factors of Ceramic Chip Capacitors , 1978 .

[4]  Kaustav Banerjee,et al.  Are carbon nanotubes the future of VLSI interconnections? , 2006, 2006 43rd ACM/IEEE Design Automation Conference.

[5]  T. Weller,et al.  Automated Characterization of Ceramic Multilayer Capacitors , 1998, 52nd ARFTG Conference Digest.

[6]  H. Greenhouse,et al.  Design of Planar Rectangular Microelectronic Inductors , 1974 .

[7]  R. A. Pucel,et al.  Design Considerations for Monolithic Microwave Circuits , 1981 .

[8]  W. Steinhögl,et al.  Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller , 2005 .

[9]  C. Chen,et al.  Through-silicon via technologies for interconnects in RF MEMS , 2009, 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS.

[10]  M. Swaminathan,et al.  Electromagnetic Modeling of Through-Silicon Via (TSV) Interconnections Using Cylindrical Modal Basis Functions , 2010, IEEE Transactions on Advanced Packaging.

[11]  P. Burke,et al.  Microwave transport in metallic single-walled carbon nanotubes. , 2005, Nano letters.

[12]  Bruce C. Kim,et al.  Analysis of carbon nanotube based Through Silicon Vias , 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

[13]  Sukeshwar Kannan,et al.  Development of Carbon Nanotube Based Through-Silicon Vias , 2010 .

[14]  J. E. Avron,et al.  Adiabatic charge pumping in open quantum systems , 2002 .

[15]  Bruce C. Kim,et al.  Development of novel carbon nanotube TSV technology , 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).