Hybrid spectral/neural model based integrated control and supervision of a distributed thermal process in IC packaging

It is difficult to achieve optimal curing for die attachment in IC packaging due to the lack of tools for on-line measurement. In practice, the cure schedule is typically determined in a trial and error process even though it is costly and may not guarantee the reliability of the adhesive die attach. A novel spectral model based integration of cure schedule optimization, supervision and decoupling control is introduced to maintain both reliability and throughput. The method is straightforward and effective, and can be easily applied to the curing supervision in electronics industry.

[1]  R. A. Pearson,et al.  Processing diagrams for polymeric die attach adhesives , 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

[2]  G. G. Stokes.  "J." , 1890, The New Yale Book of Quotations.

[3]  Guanrong Chen,et al.  Spectral-approximation-based intelligent modeling for distributed thermal processes , 2005, IEEE Transactions on Control Systems Technology.

[4]  H. Azimi,et al.  Adhesion issued in epoxy-based chip attach adhesives , 1997 .

[5]  A. Chapman.  Fundamentals of heat transfer , 1987 .

[6]  G. M.,et al.  Partial Differential Equations I , 2023, Applied Mathematical Sciences.

[7]  P. Daoutidis,et al.  Finite-dimensional control of parabolic PDE systems using approximate inertial manifolds , 1997, Proceedings of the 36th IEEE Conference on Decision and Control.

[8]  Mohamed Boutayeb,et al.  A strong tracking extended Kalman observer for nonlinear discrete-time systems , 1999, IEEE Trans. Autom. Control..

[9]  W.M. Chapman.  Knowledge acquisition of manufacturing descriptions , 1988, Fifth IEEE/CHMT International Electronic Manufacturing Technology Symposium, 1988, 'Design-to-Manufacturing Transfer Cycle.

[10]  Katsuhiko Ogata,et al.  Discrete-time control systems , 1987 .

[11]  Dierk Schroder.  Intelligent Observer and Control Design for Nonlinear Systems , 2000 .

[12]  Suman Banerjee,et al.  Nonlinear Model Reduction Strategies for Rapid Thermal Processing Systems , 1998, ICMTS 1998.

[13]  Panagiotis D. Christofides,et al.  Nonlinear and Robust Control of Pde Systems , 2001 .

[14]  R. A. Pearson,et al.  Modeling the die attach adhesives process , 1998, Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).

[15]  E. Zafiriou,et al.  Model reduction for optimization of rapid thermal chemical vapor deposition systems , 1998 .

[16]  Weiping Li,et al.  Applied Nonlinear Control , 1991 .