论文信息 - Analytical Solutions of the Diffusive Heat Equation as the Application for Multi-cellular Device Modeling - A Numerical Aspect

Analytical Solutions of the Diffusive Heat Equation as the Application for Multi-cellular Device Modeling - A Numerical Aspect

This work concerns the thermal analysis of solid state devices, namely the solution of the heat transfer problem as part of the coupled electrical-thermal analysis of an IC. We investigate some typical numerical problems which can be found during evaluating of the time dependent solution of the heat diffusion equation for a 3D finite domain with an uniform heat source. Considering a surface heat source, the solutions obtained by means of the Large Time Greens Function and Small Time Greens Function are studied. A simple method to improve the computational efficiency is proposed. A comparison of different approaches is given as well.

Zbigniew Lisik | Malgorzata Langer | Janusz Wozny | Niccolò Rinaldi

[1] Michael B. Steer,et al. Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-d systems , 2001 .

[2] A. Haji-sheikh,et al. Heat Conduction Using Green's Function , 1992 .

[3] Vincenzo d'Alessandro,et al. A critical review of thermal models for electro-thermal simulation , 2002 .

[4] Niccolò Rinaldi,et al. On the modeling of the transient thermal behavior of semiconductor devices , 2001 .

[5] J. Nowak,et al. Optimizing the numerical procedure of temperature evaluating from the heat diffusion equation , 2004, Proceedings of the International Conference Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2004..