Electrical characterization of stressed and broken down SiO2 films at a nanometer scale using a conductive atomic force microscope
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Marc Porti | Alexander Olbrich | Xavier Aymerich | Montserrat Nafría | B. Ebersberger | M. Porti | M. Nafría | X. Aymerich | B. Ebersberger | A. Olbrich
[1] R. Fowler,et al. Electron Emission in Intense Electric Fields , 1928 .
[2] E. Harari. Dielectric breakdown in electrically stressed thin films of thermal SiO2 , 1978 .
[3] R. Howard,et al. Discrete Resistance Switching in Submicrometer Silicon Inversion Layers: Individual Interface Traps and Low-Frequency ( 1 f ?) Noise , 1984 .
[4] Mark E. Welland,et al. Spatial location of electron trapping defects on silicon by scanning tunneling microscopy , 1986 .
[5] Robert J. Hamers,et al. Characterization of electron trapping defects on silicon by scanning tunneling microscopy , 1987 .
[6] Piero Olivo,et al. Low‐frequency noise in silicon‐gate metal‐oxide‐silicon capacitors before oxide breakdown , 1987 .
[7] B. Riccò,et al. High-field-induced degradation in ultra-thin SiO/sub 2/ films , 1988 .
[8] Robert A. Buhrman,et al. Defect dynamics and wear-out in thin silicon oxides , 1989 .
[9] Jordi Suñé,et al. Degradation and Breakdown of Gate Oxides in VLSI Devices , 1989, February 16.
[10] Jordi Suñé,et al. On the breakdown statistics of very thin SiO2 films , 1990 .
[11] David R. Allee,et al. Selective area oxidation of silicon with a scanning force microscope , 1993 .
[12] Jordi Suñé,et al. Exploratory observations of post‐breakdown conduction in polycrystalline‐silicon and metal‐gated thin‐oxide metal‐oxide‐semiconductor capacitors , 1993 .
[13] D. Arnold,et al. Impact ionization, trap creation, degradation, and breakdown in silicon dioxide films on silicon , 1993 .
[14] M. Welland,et al. Conducting atomic force microscopy study of silicon dioxide breakdown , 1995 .
[15] G. Abadal,et al. Nanometer‐scale oxidation of Si(100) surfaces by tapping mode atomic force microscopy , 1995 .
[16] A. E. Gordon,et al. Mechanisms of surface anodization produced by scanning probe microscopes , 1995 .
[17] M. Heyns,et al. Soft breakdown of ultra-thin gate oxide layers , 1996 .
[18] B. Kaczer,et al. Ballistic‐electron emission microscopy studies of charge trapping in SiO2 , 1996 .
[19] T. C. McGill,et al. Macroscopic and microscopic studies of electrical properties of very thin silicon dioxide subject to electrical stress , 1997 .
[20] Hiroshi Koyama,et al. Dielectric breakdown of silicon oxide studied by scanning probe microscopy , 1997 .
[21] H. J. Wen,et al. Investigation of existing defects and defect generation in device-grade SiO2 by ballistic electron emission spectroscopy , 1997 .
[22] H. J. Wen,et al. Localized degradation studies of ultrathin gate oxides , 1998 .
[23] Masakazu Ichikawa,et al. Observation and creation of current leakage sites in ultrathin silicon dioxide films using scanning tunneling microscopy , 1998 .
[24] B. Ebersberger,et al. Conducting atomic force microscopy for nanoscale electrical characterization of thin SiO2 , 1998 .
[25] Masakazu Ichikawa,et al. Characterization of local dielectric breakdown in ultrathin SiO2 films using scanning tunneling microscopy and spectroscopy , 1999 .
[26] Salvatore Lombardo,et al. Degradation and hard breakdown transient of thin gate oxides in metal–SiO2–Si capacitors: Dependence on oxide thickness , 1999 .
[27] Christian Boit,et al. High aspect ratio all diamond tips formed by focused ion beam for conducting atomic force microscopy , 1999 .
[28] Jordi Suñé,et al. Soft breakdown conduction in ultrathin (3-5 nm) gate dielectrics , 2000 .
[29] B. Neri,et al. Pre-breakdown in thin SiO2 films , 2000, IEEE Electron Device Letters.
[30] Marc Porti,et al. Nanometer-scale electrical characterization of stressed ultrathin SiO2 films using conducting atomic force microscopy , 2001 .