Method of forming a printed circuit board pattern, forming a guide for the pattern and ink for the guide

The method for printing a circuit pattern is formed, the guide forming method and an ink guide formed is disclosed. Forming a guide by the guide (Guide) The ink for forming having a slip property, printing using the step and the metal ink to the inside of the hardened guide to in situ (In-situ) UV curing the formed guide circuit pattern a pattern forming method using the printed circuit includes forming the pattern can be obtained with high aspect ratio printed circuit (Aspectratio) having a thickness and height in terms of the printed circuit pattern. A printed circuit pattern, the aspect ratio (Aspectratio), the guide (Guide)