Metallurgical factors behind the reliability of high density lead-free interconnections
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[1] D. L. Holt,et al. The stored energy of cold work , 1958 .
[2] C. Thwaites. Solderability of Coatings for Printed Circuits , 1965 .
[3] B. Bilby,et al. The theory of the crystallography of deformation twinning , 1965, Proceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences.
[4] A. L. Titchener,et al. The Stored Energy of Cold Work , 1973 .
[5] J. Verhoeven. Fundamentals of Physical Metallurgy , 1975 .
[6] E. Ziegel. Juran's Quality Control Handbook , 1988 .
[7] J. Haimovich. Intermetallic Compound Growth in Tin and Tin-Lead Platings over Nickel and Its Effects on Soderability , 1989 .
[8] W. Kurz,et al. Fundamentals of Solidification , 1990 .
[9] Van Loo,et al. Multiphase diffusion in binary and ternary solid-state systems , 1990 .
[10] W. Tiller. The Science of Crystallization , 1991 .
[11] Thomas Rbement,et al. Fundamentals of quality control and improvement , 1993 .
[12] Paul T. Vianco,et al. Issues in the replacement of lead-bearing solders , 1993 .
[13] J. Kivilahti,et al. Feasibility of Some Lead‐free Solder Alloys as Filler Materials for Z‐axis Adhesives , 1995 .
[14] Jorma Kivilahti,et al. Modeling joining materials for microelectronics packaging , 1995 .
[15] A Thermal Fatigue Failure Mechanism of 58Bi-42Sn Solder Joints , 1996 .
[16] R. W. Cahn. CHAPTER 28 – RECOVERY AND RECRYSTALLIZATION , 1996 .
[17] B. Moran,et al. Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders , 1997 .
[18] J. Kivilahti,et al. The local nominal composition-useful concept for microjoining and interconnection applications , 1997 .
[19] Ursula R. Kattner,et al. The thermodynamic modeling of multicomponent phase equilibria , 1997 .
[20] J. Kivilahti,et al. A diffusion-kinetic model for predicting solder/conductor interactions in high density interconnections , 1998 .
[21] G. Vojta,et al. Phase Equilibria, Phase Diagrams and Phase Transformations. Their Thermodynamic Basis , 1999 .
[22] D. Frear,et al. Pb-free solders for flip-chip interconnects , 2001 .
[23] Kwang-Lung Lin,et al. Sn-Zn-Al Pb-free solder—An inherent barrier solder for Cu contact , 2001 .
[24] J. Kivilahti. The Chemical Modeling of Electronic Materials and Interconnections , 2002 .
[25] Hao Yu,et al. CFD modelling of the flow field inside a reflow oven , 2002 .
[26] W. J. DeCoursey,et al. Introduction: Probability and Statistics , 2003 .
[27] Won Kyoung Choi,et al. Effects of mechanical deformation and annealing on the microstructure and hardness of Pb-free solders , 2003 .
[28] Jorge L. Romeu,et al. Practical Reliability Engineering , 2003, Technometrics.
[29] Sung K. Kang,et al. The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue , 2004 .
[30] Rob Schetty. Lead-Free Finishes for Printed Circuit Boards and Components , 2004 .
[31] A. Paul,et al. The Kirkendall effect in solid state diffusion , 2004 .
[32] Y. Nemoto,et al. High-performance vertical interconnection for high-density 3D chip stacking package , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[33] T. Chiu,et al. Effect of thermal aging on board level drop reliability for Pb-free BGA packages , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[34] T. Mattila,et al. Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections , 2004 .
[35] M. Amagai,et al. High drop test reliability: lead-free solders , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[36] K. Puttlitz,et al. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies , 2004 .
[37] Tomi Laurila,et al. Analyses of interfacial reactions at different levels of interconnection , 2004 .
[38] S. Terashima,et al. Thermal Fatigue Properties of Sn-1.2Ag-0.5Cu-xNi Flip Chip Interconnects , 2004 .
[39] Masako Nozaki,et al. Recrystallization of Sn Grains due to Thermal Strain in Sn-1.2Ag-0.5Cu-0.05Ni Solder , 2004 .
[40] E.H. Wong,et al. Dynamic materials testing and modeling of solder interconnects , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[41] T. Laurila,et al. Analysis of the redeposition of AuSn4 on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders , 2005 .
[42] P. Marjamaki,et al. Deformation characteristics and microstructural evolution of SnAgCu solder joints , 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..
[43] Tomi Laurila,et al. Interfacial reactions between lead-free solders and common base materials , 2005 .
[44] Jorma Kivilahti,et al. Failure mechanisms of lead-free chip scale package interconnections under fast mechanical loading , 2005 .
[45] T. Laurila,et al. Phase formation between lead-free Sn–Ag–Cu solder and Ni(P)∕Au finishes , 2006 .
[46] P. Marjamaki,et al. Reliability of CSP Interconnections Under Mechanical Shock Loading Conditions , 2006, IEEE Transactions on Components and Packaging Technologies.
[47] T. Mattila,et al. Thermal Simulation of the Solidification of Lead-Free Solder Interconnections , 2006, IEEE Transactions on Components and Packaging Technologies.
[48] Tomi Laurila,et al. Phase formation between Lead-free SnAgCu Solder and Ni(P)/Au Finish on PWB , 2006 .
[49] Mats Hillert,et al. Phase equilibria, phase diagrams and phase transformations : Their thermodynamic basis, second edition , 2007 .