Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method
暂无分享,去创建一个
[1] D. Chopp,et al. Extended finite element method and fast marching method for three-dimensional fatigue crack propagation , 2003 .
[2] Ted Belytschko,et al. Elastic crack growth in finite elements with minimal remeshing , 1999 .
[3] Ted Belytschko,et al. A finite element method for crack growth without remeshing , 1999 .
[4] P. Reimers. Simulation of mixed mode fatigue crack growth , 1991 .
[5] David L. Chopp,et al. A hybrid extended finite element/level set method for modeling phase transformations , 2002 .
[6] Thomas H. Hyde,et al. Mixed mode fatigue crack growth at 550°c under plane stress conditions in Jethete M152 , 1991 .
[7] J. Sethian,et al. Fronts propagating with curvature-dependent speed: algorithms based on Hamilton-Jacobi formulations , 1988 .
[8] James A. Sethian,et al. The Fast Construction of Extension Velocities in Level Set Methods , 1999 .
[9] L. Freund,et al. Spiral Cracking Around a Strained Cylindrical Inclusion in a Brittle Material and Implications for Vias in Integrated Circuits , 1991 .
[10] D. Chopp. Computing Minimal Surfaces via Level Set Curvature Flow , 1993 .
[11] Leon M Keer,et al. Fatigue Crack Growth in Mixed Mode Loading , 1991 .
[12] T. Belytschko,et al. Non‐planar 3D crack growth by the extended finite element and level sets—Part I: Mechanical model , 2002 .
[13] J. A. Sethian,et al. Fast Marching Methods , 1999, SIAM Rev..
[14] J. Hutchinson,et al. Crack patterns in thin films , 2000 .
[15] D. Chopp,et al. Fatigue crack propagation of multiple coplanar cracks with the coupled extended finite element/fast marching method , 2003 .
[16] Keisuke Tanaka,et al. Fatigue crack propagation from a crack inclined to the cyclic tensile axis , 1974 .
[17] Ted Belytschko,et al. Modelling crack growth by level sets in the extended finite element method , 2001 .
[18] T. Belytschko,et al. Non‐planar 3D crack growth by the extended finite element and level sets—Part II: Level set update , 2002 .
[19] F. Cardarelli. Materials Handbook — a concise desktop reference: Pub 2000, ISBN 1-85233-168-2. 595 pages, £80 , 2001 .
[20] P. C. Paris,et al. A Critical Analysis of Crack Propagation Laws , 1963 .
[21] R. H. Havemann,et al. High-performance interconnects: an integration overview , 2001, Proc. IEEE.
[22] T. Kenny,et al. Fatigue Processes in Silicon MEMS Devices , 2001 .
[23] Brian Moran,et al. Crack tip and associated domain integrals from momentum and energy balance , 1987 .
[24] D. Chopp,et al. Modelling crack growth by level sets , 2013 .
[25] Evan G. Colgan,et al. Interconnect fabrication processes and the development of low-cost wiring for CMOS products , 1995, IBM J. Res. Dev..
[26] T. Belytschko,et al. MODELING HOLES AND INCLUSIONS BY LEVEL SETS IN THE EXTENDED FINITE-ELEMENT METHOD , 2001 .
[27] H. Fujimoto,et al. Developing design rules to avert cracking and debonding in integrated circuit structures , 2000 .