Signal propagation effects on high‐speed interconnection lines using time‐domain numerical technique

With advancements in microelectronics, interest in electromagnetic interference and compatibility in high-speed circuits has greatly increased in the engineering community, and application of computational electromagnetics to electromagnetic interference and compatibility (EMI/EMC) engineering has become an emerging technology. Termination, via, and crosstalk on interconnection lines raises EMI problems in high-speed circuits and requires attention during design phases for signal integrity. This paper analyzes signal propagation effects among different parts of high-speed interconnection lines using the finite-difference time-domain (FDTD) method. The mechanism and the effectiveness of control measures are examined, which can be applied to high-speed circuit designs. © 2002 Wiley Periodicals, Inc. Microwave Opt Technol Lett 35: 416–420, 2002; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.10624