Improved electrical and reliability performance of 65nm interconnects with new barrier integration schemes
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X. Federspiel | M. Grégoire | R. Bouyssou | R. Delsol | V. Girault | P. Normandon | J. Jacquemin | P. Vannier
[1] E. Royet,et al. TaN/Ta bilayer barrier characteristics and integration for 90 and 65nm nodes , 2005 .
[2] K. Maex,et al. Simulations of diffusion barrier deposition on porous low- k films , 2003 .