An Overview of Iris and Retina Scans and their Fusion in a Biometric System

High frequency noise is decoupled from power supplied to Pin Grid Array (PGA), surface mounted leaded chip carrier and surface mounted leadless chip carrier packages by insertion of a decoupling capacitor between the PGA or leaded chip carrier package and printed circuit board; or by mounting the decoupling capacitor over a leadless chip carrier package. The decoupling capacitor comprises a multi layer capacitive element sandwiched between a pair of conductors and having a plurality of leads extending from each conductor. In accordance with the present invention, the decoupling capacitor is individually dimensioned and configured to fit under a PGA or leaded chip carrier package, or over a leadless chip carrier package; and correspond to the power and ground pin or lead configuration of that PGA, surface mounted leaded chip carrier and surface mounted leadless chip carrier package.