Mechanical lapping, handling and transfer of ultra-thin wafers

This paper presents a new technique for thinning down up to 10 m and handling various semiconductor devices, and transferring them onto host substrates. An optimized mechanical lapping is used to remove the wafer backside after the fabrication process by way of a cavity-wafer. The original transfer technique based on the different thermal properties of waxes or epoxy layers is described, and the electrical results obtained on test devices are presented.