HOT WATER COOLED HEAT SINKS FOR EFFICIENT DATA CENTER COOLING: TOWARDS ELECTRONIC COOLING WITH HIGH EXERGETIC UTILITY

Electronic data center cooling using hot water is proposed for high system exergetic utility. The proof-of-principle is provided by numerically modeling a manifold micro-channel heat sink for cooling microprocessors of a data center. An easily achievable 0.5l/min per chip water flow, with 60°C inlet water temperature, is found sufficient to address the typical data center thermal loads. A maximum temperature difference of ~8°C was found between the solid and liquid, confirming small exergetic destruction due to heat transport across a temperature differential. The high water outlet temperature from the heat sink opens the possibility of waste heat recovery applications.

[1]  D. Copeland,et al.  Manifold microchannel heat sinks: isothermal analysis , 1996, InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V.

[2]  Sung Jin Kim,et al.  Fluid Flow and Thermal Characteristics of a Microchannel Heat Sink Subject to an Impinging Air Jet , 2005 .

[3]  V. Modi,et al.  Mass transfer in turbulent impinging slot jets , 1999 .

[4]  E. Colgan,et al.  A practical implementation of silicon microchannel coolers for high power chips , 2005, Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005..

[5]  J. Koomey.  Worldwide electricity used in data centers , 2008 .

[6]  T. Brunschwiler,et al.  Self-Contained, Oscillating Flow Liquid Cooling System for Thin Form Factor High Performance , 2010 .

[7]  R. Pease,et al.  High-performance heat sinking for VLSI , 1981, IEEE Electron Device Letters.

[8]  B. Michel,et al.  Direct Liquid Jet-Impingment Cooling With Micron-Sized Nozzle Array and Distributed Return Architecture , 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

[9]  B. W. Webb,et al.  Single-Phase Liquid Jet Impingement Heat Transfer , 1995 .

[10]  Thomas Brunschwiler,et al.  Toward zero-emission data centers through direct reuse of thermal energy , 2009, IBM J. Res. Dev..

[11]  G. Morini,et al.  Nusselt numbers in laminar flow for H2 boundary conditions , 1996 .

[12]  Sung Jin Kim,et al.  Forced Convection in Microstructures for Electronic Equipment Cooling , 1999 .

[13]  Thomas Brunschwiler,et al.  Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips , 2010 .

[14]  Andrew Pollard,et al.  Heat transfer in separated and impinging turbulent flows , 1996 .

[15]  R. Viskanta,et al.  Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging , 2000 .

[16]  Thomas Brunschwiler,et al.  Thermal Management of Vertically Integrated Packages , 2008 .

[17]  Sung Jin Kim,et al.  Three-dimensional numerical optimization of a manifold microchannel heat sink , 2003 .

[18]  Dimos Poulikakos,et al.  A novel high performance, ultra thin heat sink for electronics , 2010 .

[19]  G. I. Meijer,et al.  Cooling Energy-Hungry Data Centers , 2010, Science.

[20]  Thomas Brunschwiler,et al.  Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design , 2010 .

[21]  Ephraim M Sparrow,et al.  Influence of Bed Size on the Flow Characteristics and Porosity of Randomly Packed Beds of Spheres , 1973 .

[22]  Xia Guo.  THREE-DIMENSIONAL NUMERICAL OPTIMIZATION OF THE MANIFOLD MICROCHANNEL HEAT SINK , 2006 .