Application of the PCB-Embedding Technology in Power Electronics – State of the Art and Proposed Development

The embedding of components in Printed Circuit Board (PCB) material is an attractive solution to improve the performance of power converters in the 1 W–100 kW range by increasing the power density (exploitation of unused volume in the PCB), reducing circuit parasitics (strip-line approach to current distribution, shorter interconnects), and improving manufacturability (rationalization of the manufacturing process, automation). This paper presents a review of the embedding technologies, with a special focus on power components (passive, active) and thermal mangement. The second part of the article is dedicated to the design process, and proposes a new design approach, inspired from microelectronics. The ambition is to simplify the design process by using "design toolkits". These toolkits would provide the designer with elements such as design rules, libraries or models. The objective is to enable automatic design validation, and to ensure the design can be produced directly.

[1]  C. M. Johnson,et al.  Automated Fast Extraction of Compact Thermal Models for Power Electronic Modules , 2013, IEEE Transactions on Power Electronics.

[2]  Fred C. Lee,et al.  High-Frequency High Power Density 3-D Integrated Gallium-Nitride-Based Point of Load Module Design , 2013, IEEE Transactions on Power Electronics.

[3]  Fred C. Lee,et al.  High-Density Integration of High-Frequency High-Current Point-of-Load (POL) Modules With Planar Inductors , 2015, IEEE Transactions on Power Electronics.

[4]  F. Lee,et al.  On a Future for Power Electronics , 2013 .

[5]  Zhaoan Wang,et al.  Design Considerations for Passive Substrate with Ferrite Materials Embedded in Printed Circuit Board (PCB) , 2007, 2007 IEEE Power Electronics Specialists Conference.

[6]  Johann W. Kolar,et al.  ηρ-Pareto optimization and comparative evaluation of inverter concepts considered for the GOOGLE Little Box Challenge , 2016, 2016 IEEE 17th Workshop on Control and Modeling for Power Electronics (COMPEL).

[7]  Johann W. Kolar Approaches to Overcome the Google Little-Box Challenges , 2015 .

[8]  Slobodan Cuk,et al.  A general unified approach to modelling switching-converter power stages , 1976, 1970 IEEE Power Electronics Specialists Conference.

[9]  Peter Haumer,et al.  Enhanced heat transport in printed circuit boards via passive components embedding , 2017, 2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac).

[10]  Takayasu Sakurai,et al.  Embedded planar power inductor technology for package-level DC power grid , 2015, 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).

[11]  Wolfgang Wondrak,et al.  Lifetime and manufacturability of integrated power electronics , 2016, Microelectron. Reliab..

[12]  Jean-Christophe Crebier,et al.  Generic Approach for Design, Configuration and Control of Modular Converters , 2017 .

[13]  Y. Khersonsky,et al.  PEBB - Power Electronics Building Blocks from Concept to Reality , 2006, 2006 Record of Conference Papers - IEEE Industry Applications Society 53rd Annual Petroleum and Chemical Industry Conference.

[14]  P. Bauer,et al.  Toward the Next Level of PCB Usage in Power Electronic Converters , 2008, IEEE Transactions on Power Electronics.

[15]  J. Nicolics,et al.  Thermal benchmark of a classic and novel embedded high-power 3-phase inverter Bridge , 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

[16]  J. W. Kolar,et al.  Multiobjective Optimization of Ultraflat Magnetic Components With PCB-Integrated Core , 2013, IEEE Transactions on Power Electronics.

[17]  H. Morel,et al.  Evaluation of printed-circuit boards materials for high temperature operation , 2017 .

[18]  David Frey,et al.  Silicon carbide power chip on chip module based on embedded die technology with paralleled dies , 2015, 2015 IEEE Energy Conversion Congress and Exposition (ECCE).

[19]  L. Boettcher,et al.  Power modules with embedded components , 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).

[20]  Johann W. Kolar,et al.  Comprehensive Design and Optimization of a High-Power-Density Single-Phase Boost PFC , 2009, IEEE Transactions on Industrial Electronics.

[22]  J.Y. Park,et al.  Ni-Zn Ferrite Screen Printed Power Inductors for Compact DC-DC Power Converter Applications , 2009, IEEE Transactions on Magnetics.

[23]  S. Lefebvre,et al.  PCB-Embedding of Power Dies Using Pressed Metal Foam , 2019 .

[25]  Dushan Boroyevich,et al.  IPEM-Based Power Electronics System Integration , 2008 .

[26]  A. Kivikero,et al.  Embedding active components inside printed circuit board (PCB) - a solution for miniaturization of electronics , 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

[27]  Gourab Majumdar,et al.  Review of Integration Trends in Power Electronics Systems and Devices , 2016 .

[28]  Eric Laboure,et al.  Comparison of topside contact layouts for power dies embedded in PCB , 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

[29]  Stéphane Lefebvre,et al.  Using Laminated Metal Foam as the Top-Side Contact of a PCB-Embedded Power Die , 2017, IEEE Electron Device Letters.

[30]  Cyril Buttay,et al.  Implementation and Switching Behavior of a PCB-DBC IGBT Module Based on the Power Chip-on-Chip 3-D Concept , 2017, IEEE Transactions on Industry Applications.

[31]  S.C.O. Mathuna,et al.  Packaging and integration technologies for future high frequency power supplies , 2002, IEEE 2002 28th Annual Conference of the Industrial Electronics Society. IECON 02.

[32]  Fred Barlow,et al.  An overview to integrated power module design for high power electronics packaging , 2000 .

[33]  S. Lefebvre,et al.  Thermal fatigue and failure of electronic power device substrates , 2009 .

[34]  Lynn Conway,et al.  Introduction to VLSI systems , 1978 .

[35]  Josef Lutz,et al.  Improving the short circuit ruggedness of IGBTs , 2016, Microelectron. Reliab..

[36]  Homer Alan Mantooth,et al.  High Performance Silicon Carbide Power Packaging—Past Trends, Present Practices, and Future Directions , 2017 .

[37]  Cyril Buttay,et al.  High power PCB-embedded inductors based on ferrite powder , 2017 .

[38]  J. Kolar,et al.  Ultra-Low-Inductance Power Module for Fast Switching Semiconductors , 2013 .

[39]  Rolando Burgos,et al.  2 MHz high-density integrated power supply for gate driver in high-temperature applications , 2016, 2016 IEEE Applied Power Electronics Conference and Exposition (APEC).

[40]  P. Beckedahl,et al.  400 A, 1200 V SiC power module with 1nH commutation inductance , 2016 .

[41]  Cyril Buttay,et al.  Highly integrated power electronic converters using active devices embedded in printed-circuit board , 2015 .

[42]  N. Degrenne,et al.  Thermal management of a low-cost 2kW solar inverter , 2014, 2014 16th European Conference on Power Electronics and Applications.

[43]  Lars Böttcher,et al.  Characteristics and aging of PCB embedded power electronics , 2015, Microelectron. Reliab..

[44]  F. Costa,et al.  Design of a Hybrid Integrated EMC Filter for a DC–DC Power Converter , 2012, IEEE Transactions on Power Electronics.

[45]  K.D.T. Ngo,et al.  Technology roadmap for high frequency integrated DC-DC converter , 2009, 2009 IEEE 6th International Power Electronics and Motion Control Conference.

[46]  Eckart Hoene,et al.  Packages for Fast Switching HV GaN Power Devices , 2014 .

[47]  Ryan J. Lewis,et al.  Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology , 2017 .

[48]  M. Mueller,et al.  Highly efficient and flexible plasma based copper coating process for the manufacture of direct metallized mechatronic devices , 2016, 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC).

[49]  Peter Anders,et al.  PCB embedded power package with reinforced top-side chip contacts , 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

[50]  Cyril Buttay,et al.  Characterization of materials and their interfaces in a direct bonded copper substrate for power electronics applications , 2017, Microelectron. Reliab..

[51]  J.A. Ferreira,et al.  Design method and material technologies for passives in printed circuit Board Embedded circuits , 2005, IEEE Transactions on Power Electronics.

[52]  S. Waffler,et al.  Performance trends and limitations of power electronic systems , 2010, 2010 6th International Conference on Integrated Power Electronics Systems.

[53]  Andreas Kugler,et al.  Chip Embedding in Laminates , 2011 .

[54]  U. Drofenik,et al.  Towards virtual prototyping and comprehensive multi-objective optimisation in power electronics , 2010 .

[55]  E. Waffenschmidt Design and application of thin, planar magnetic components for embedded passives integrated circuits , 2004, 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551).

[56]  Cyril Buttay,et al.  Comparison of planar and Toroidal PCB integrated inductors for a multi-cellular 3.3 kW PFC , 2017, 2017 IEEE International Workshop On Integrated Power Packaging (IWIPP).

[57]  John Prymak,et al.  High Capacitance Stacked Multi-Layer Ceramic Capacitors for Power Supplies , 2010 .

[58]  Brian Narveson,et al.  3-D Embedded Packaging Technology: Analyzing its needs and challenges , 2015, IEEE Power Electronics Magazine.

[59]  D. Cottet Industry perspective on multi domain simulations and virtual prototyping , 2008, 2008 11th Workshop on Control and Modeling for Power Electronics.

[60]  Hannes Stahr,et al.  Embedded power electronics on the way to be launched , 2015, 2015 European Microelectronics Packaging Conference (EMPC).

[61]  Dushan Boroyevich,et al.  Two comparison-alternative high temperature PCB-embedded transformer designs for a 2 W gate driver power supply , 2016, 2016 IEEE Energy Conversion Congress and Exposition (ECCE).

[62]  D. Shaddock,et al.  Reliability of High Temperature Laminates , 2015 .

[63]  Nicolas Degrenne,et al.  Design, manufacturing and characterization of printed circuit board embedded inductors for power applications , 2018, 2018 IEEE International Conference on Industrial Technology (ICIT).

[64]  J. Saiz,et al.  Multi-domain simulation platform for virtual prototyping of integrated power systems. , 2007, 2007 European Conference on Power Electronics and Applications.

[65]  M. Brizoux,et al.  Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR , 2010 .