Recently there has been considerable interest in the use of the open microstrip geometry as a transmission line in microwave integrated circuits. This form of propagating structure is applicable to a monolithic approach on a semiconductor substrate as well as to a hybrid approach using a ceramic substrate. In order to choose suitable materials, we have investigated the basic properties of microstrip and its interactions with the substrate. A detailed experimental investigation has brought to light two important aspects of circuit design with microstrip. First, microstrip has an upper frequency limit and second, it is dispersive.
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