Failure Analysis of Thick Wire Bonds
暂无分享,去创建一个
[1] Karumbu Nathan Meyyappan. FAILURE PREDICTION OF WIRE BONDS DUE TO FLEXURE , 2004 .
[2] Ali H. Nayfeh,et al. A reduced-order model for electrically actuated microbeam-based MEMS , 2003 .
[3] G. Harman. Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield , 1997 .
[4] Guy Lefranc,et al. Aluminum bond-wire properties after 1 billion mechanical cycles , 2003, Microelectron. Reliab..
[5] B. Nogarede,et al. Comparison between electromagnetic and thermal stress induced by Direct Current flow in IGBT bond wires , 2012, 2012 7th International Conference on Integrated Power Electronics Systems (CIPS).
[6] Walter Lacarbonara,et al. A Theoretical and Experimental Investigation of Nonlinear Vibrations of Buckled Beams , 1997 .
[7] M. Petzold,et al. Mechanical fatigue properties of heavy aluminium wire bonds for power applications , 2008, 2008 2nd Electronics System-Integration Technology Conference.
[8] Gerhard Wachutka,et al. Reliability model for Al wire bonds subjected to heel crack failures , 2000 .
[9] O. Schilling,et al. Power cycling testing and FE modelling focussed on Al wire bond fatigue in high power IGBT modules , 2012, Microelectron. Reliab..
[10] Michel Mermet-Guyennet,et al. Revisiting power cycling test for better life-time prediction in traction , 2007, Microelectron. Reliab..