Application of AI-enabled Simulation in Power Package Development
暂无分享,去创建一个
[1] Jingshen Wu,et al. AI-enabled Automatic Molding Compound Selection for A Power Device with High Solder Joint Reliability , 2022, 2022 23rd International Conference on Electronic Packaging Technology (ICEPT).
[2] Jingshen Wu,et al. Machine Learning Enabled Optimization of Pick-up Process for Thin Die , 2021, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT).
[3] K. Chiang,et al. An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging , 2021, Materials.
[4] Xuejun Fan,et al. Solder Joint Reliability Risk Estimation by AI-Assisted Simulation Framework with Genetic Algorithm to Optimize the Initial Parameters for AI Models , 2021, Materials.
[5] Jiajie Fan,et al. Deep machine learning of the spectral power distribution of the LED system with multiple degradation mechanisms , 2020, Journal of Mechanics.
[6] J. Lau,et al. Panel-Level Chip-Scale Package With Multiple Diced Wafers , 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[7] Cheng Chen,et al. Warpage Prediction and Optimization for Embedded Silicon Fan-Out Wafer-Level Packaging Based on an Extended Theoretical Model , 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[8] Rennier Rodriguez,et al. Pick and Place Process Optimization for Thin Semiconductor Packages , 2019, Journal of Engineering Research and Reports.
[9] C. Ko,et al. Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers , 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).
[10] Frank Hutter,et al. Maximizing acquisition functions for Bayesian optimization , 2018, NeurIPS.
[11] Yong Liu,et al. Thin and large die assembly pick up process optimization by dynamic modeling , 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).
[12] Tang Liang,et al. Study on thin die pick-up process based on Taguchi method , 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).
[13] Carl E. Rasmussen,et al. Gaussian processes for machine learning , 2005, Adaptive computation and machine learning.
[14] Sheng-Jye Hwang,et al. Static analysis of the die picking process , 2005, IEEE Transactions on Electronics Packaging Manufacturing.
[15] H. Henning Winter,et al. Determination of discrete relaxation and retardation time spectra from dynamic mechanical data , 1989 .
[16] R. Landel,et al. The Temperature Dependence of Relaxation Mechanisms in Amorphous Polymers and Other Glass-Forming Liquids , 1955 .